[Stephen, Clare, Hiya, Radhika]

We started a cooldown on Thursday with an undoped Si wafer in Megastat [2794]. The chamber does not have the Maglite flashlight installed, due to struggles with soldering the ground wire to the aluminum surface of the flashlight. We decided to pivot to drilling a hole in the aluminum, wrapping the ground wire through and around, and then applying solder to the joint. This will be completed by next week.

Tasks:

• Order new RTDs [done]
• Order new heater to aid in chamber warmup (not for actuating on wafer) [Stephen]
• Calibrate new RTDs in an ice bath and LN2 bath [Hiya, Clare]
• Finalize aluminum sheet design [Stephen]
• Finalize baseplate design [Stephen]
• Drill hole in Maglite to solder ground wire [Stephen, if time]
• Continue optimal excitation analysis [Hiya]
• Finalize final report abstract [Hiya]
• Continue MCMC model development [Clare]

These tasks will ideally lead up to a Si wafer cooldown next week with optimal heat excitation and with an RTD re-installed on the cold head, and potentially with the finalized baseplate and aquadag-coated Al sheet on the cold plate. It is with this cooldown that we can start to estimate the sample’s emissivity, first with least-squares fitting and eventually with MCMC analysis.