According to the past backscatter test of the OMC (and the black glass beamdump: not V type but triangular type on a hexagonal-mount), the upper limit of the back reflection was 0.13ppm. https://nodus.ligo.caltech.edu:8081/OMC_Lab/209
I don't have a BRDF measurement. We can send a few black glass pieces to Josh.
The output of Mephisto 800NE (former TNI laser) was measured.
The output power was measured with Thorlabs sensors (S401C and S144C). The reference output record on the chassis says the output was 837mW at 2.1A injection.
They all showed some discrepancy. Thus we say that the max output of this laser is 1.03W at 2.1A injection based on the largest number I saw.
To spare some room on the optical table, I wanted to mount the two TFT monitor units on the HEPA enclosure frame.
I found some Bosch Rexroth parts (# 3842539840) in the lab, so the bracket was taken for the mount. This swivel head works very well. It's rigid and still the angle is adjustable.
BTW, this TFT display (Triplett HDCM2) is also very nice. It has HDMI/VGA/Video/BNC inputs (wow perfect) and the LCD is Full-HD LED TFT.
The only issue is that one unit (I have two) shows the image horizontally flipped. I believe that I used the unit with out this problem before, I'm asking the company how to fix this.
The image flipping of the display unit was fixed. The vendor told me how to fix it.
- Open the chassis by the four screws at the side.
- Look at the pass-through PCB board between the mother and display boards.
- Disconnect the flat flex cables from the pass-through PCB (both sides) and reconnect them (i.e. reseat the cables)
That's it and it actually fixed the image flipping issue.
See this entry: https://nodus.ligo.caltech.edu:8081/40m/15642
Thorlabs' powermeter controler + S401C head was lent from OMC Lab. Returned to OMC Jul 15, 2022 KA
I helped to complete the 5th OMC Transport Fixture. It was built at the 40m clean room and brought to the OMC lab. The fixture hardware (~screws) were also brought there.
FEMTO DLPCA200 low noise preamp (brand new)
Keithley Source Meter 2450 (brand new) => Returned 11/23/2020
were brought to the OMC lab for temporary use.
Dark current measurement for InGaAs QPDs (OSI FCI-InGaAs-Q3000) has been done using Keithley 2450 and Frank's diode test kit. Frank's setup uses various custom instruments which are no longer exist, therefore the kit was used only for switching between the segments.
The diodes were serialized as 81, 82, 83, 84, continuing the numbering for the OMC QPDs. The numbers are engraved at the side and the back of the diode cans.
Overall, the QPDs nominally indicated the usual dark current level of <10nA.
SEG1 of #82 showed a lower voltage of reverse breakdown but this is not a critical level.
#83 showed variations between the segments compared to the uniform characteristics of #81 and #84.
To know any anomaly to the junction capacitance of the QPD segments, the RF impedances were tested with a hand-made impedance measurement.
All segments look almost identical in terms of capacitance.
The impedance of a device can be measured, for example, from the complex reflection coefficient (S11). To measure the reflection, a bidirectional coupler was brought from the 40m. Attachments 1 and 2 shows the connection. The quantity A/R shows S11. The network analyzer can convert a raw transfer function to an impedance in Ohm.
Calibration and Measurement limit:
The network analyzer was calibrated with 1) a piece of wire to short the clips 2) 50ohm resistor 3) open clips. Then the setup was tested with these three conditions (again). Attachment 3 shows the result. Because of the impedance variation of the system (mainly from the Pomona clip, I guess), there looks the systematic measurement error of ~1pF or ~25nH. Above 100MHz, the effect of the stray impedance is large such that the measurement is not reliable.
The setup was tested with a 10pF ceramic capacitor and this indicated it is accurate at this level. The setup is sufficient for measuring the diode junction capacitance of 300~500pF.
Impedance of the QPD segments:
Then the impedances of the QPD segments were measured (Attachment 4). The segments showed the identical capacitance of 300~400pF level, except for the variation of the stray inductance at high freq, which we can ignore. Note that there is no bias voltage applied and the nominal capacitance in the datasheet is 225pF at 5V reverse bias. So I can conclude that the QPDs are quite nominal in terms of the junction capacitance.
(Ed: 11/23/2020 The RF components were returned to the 40m)
The dark noise levels of the four Q3000 QPDs were measured with FEMTO DLPCA200 low noise transimpedance amp.
The measurement has been done in the audio frequency band. The amp gain was 10^7 V/A. The reverse bias was set to be 5V and the DC output of the amplifier was ~40mV which corresponds to the dark current of 4nA. It is consistent with the dark current measurement.
The measured floor level of the dark current was below the shot noise level for the DC current of 0.1mA (i.e. 6pA/rtHz).
No anomalous behavior was found with the QPDs.
Note that there is a difference in the level of the power line noise between the QPDs. The large part of the line noises was due to the noise coupling from a soldering iron right next to the measurement setup, although the switch of the iron was off. I've noticed this noise during the measurement sets for QPD #83. Then the iron was disconnected from the AC tap.
The amplifier BW was 400kHz at the gain of 1e7 V/A. And the max BW is 500kHz even at a lower gain. I have to setup something special to see the RF band dark noise.
With this situation, I stated "the RF dark noise should be characterized by the actual WFS head circuit." in the 40m ELOG.
Item loan: SRS LCR meter SRS720 borrowed from Downs. The unit is at the 40m right now for testing with an excelitas PD. Once it is done, the setup will be moved to the OMC lab for testing the high QE PDs
Attachment 1: System diagram. The reverse bias voltage is controlled by DS335. This can produce a voltage offset up to 10V. A G=+2 opamp circuit was inserted so that a bias of up to +15V can be produced. The capacitances of the photodiodes were measured with SR720 LCR meter with a probe. DS335 and SR720 were controlled from PC/Mac via serial connections.
Attachment 2: Overview
Attachment 3: How was the probe attached to the photodiode under the test
Attachment 4: The bias circuitry and the power supply
Attachment 5: G=+2 amp
The capacitance at no bias was 460~500pF. This goes down to below 300pF at 1.0~1.5V reverse bias. At maximum +15V, the capacitance goes down to 200~220pF.
On this opportunity, the capacitances of a couple of Excelitas C30665 photodiodes were measured. In Attachment 2, the result was compared with one of the results from the high QE PDs. In general the capacitance of C30665 is lower than the one from the high QE PDs.
I've cleared the small optical table and wondered how to move it out of the room. Fortunately, the north side of the big table had wide enough clearance and let the 36" wide table go through. This was easy without moving other heavy stuff.
From here to the door, a bit of work is required. A possibility is to roll the laser blocking wall to the south side of the big table. This will require moving the shelving in the entrance area but it's not a lot of work compared to disassembling a part of the wall.
If this does not work somehow, we will consider removing the last panel of the wall and it will definitely allow the table to get out from the door.
The table width was an inch too large compared to the door width. We need to tilt the table and it seemed too much for us. Let's ask the transportation for handling.
Photo courtesy by Juan
- The lab is chilly (18degC)
- Cleaned the lab and the optical table a bit so that the delicate work can be done. The diode test rig (borrowed from Downs - see OMC ELOG 408 and OMC ELOG 409) was removed from the table and brought to the office (to return on Monday)
- The rack electronics were energized.
- The OMC mirrors in use were returned to the cases and stored in the plastic box.
- The optical table was also cleaned. Removed the old Al foils. The table was wiped with IPA
- The OMC #4 was moved to the other part of the table, and then OMC #2 was placed in the nominal place (Attachment 1). Note that the "legs" were migrated from #4 to #2. There are three poles that defines the location of the OMC Transportation
- The lid was removed and the OMC was inspected (Attachment 2). Immediately found some more delamination of the epoxy beneath the cable bracket (Attachment 3). This needs to be taken care of before shipment.
- The cavity was already flashing as usual, and a bit of alignment made the TEM00 flashing.
- The locking was a little tricky because the LB unit seemed to have a gain-dependent offset. After some adjustment, robust locks were achieved. The cavity was then finely adjusted. Attachment 4 shows the CCD image of the reflection. The core of the spot is more or less axisymmetric as usual. There is also a large helo around the spot. I was not aware of this before. I may need to wipe some of the mirrors of the input path.
- As the satisfactory lock was achieved, I called a day by taking a picture of the table (Attachment 5).
== Initial Preparation ==
== Measurements ==
== Repair / Preparation ==
== Shipping ==
o Power Budget (2022/07/18)
NPRO ADJ -50 (min)
Fiber incident 62.8mW
Fiber output 45.1mW
Matching to the fiber 72%
DCPD T = 8.90 +/- 0.01 mW
REFPD = 3.760 +/- 0.001 V
DCPD R = 8.82 +/- 0.01 V
REFPD = 3.760 +/- 0.001 V
CM1 = 81.4 +/- 0.1 uW
REFPD = 3.767 +/- 0.001 V
CM2 = 86.6 +/- 0.1 uW
REFPD = 3.767 +/- 0.001 V
OFS = -6.214 +/- 0.001 mV (beam blocked)
LOCKED = 57.5 +/- 0.5 mV
REFPD = 3.970 +/- 0.003 V
UNLOCK = 2.816 +/- 0.003 V
REFPD = 3.943 +/- 0.001 V
P_Inc = 20.04 +/- 0.01 mW
REFPD = 3.946 +/- 0.001 V
- Cavity coupling 0.989 (1.1% junk&sidebands)
- Cavity R&T: R=756ppm, T=0.946
- OMC Throughput (Cavity T x First BS R): T=0.939
- Cavity loss per mirror 90 ppm / Round Trip Loss 432ppm
o Power Budget after FirstContact cleaning (2022/07/20)
NPRO ADJ -50 (min)
Fiber incident --.-mW
Fiber output --.-mW
Matching to the fiber ??%
DCPD T = 8.62 +/- 0.01 mW
REFPD = 3.549 +/- 0.001 V
DCPD R = 9.46 +/- 0.01 V
REFPD = 3.562 +/- 0.001 V
CM1 = 74.5 +/- 0.1 uW
REFPD = 3.585 +/- 0.001 V
CM2 = 81.7 +/- 0.1 uW
REFPD = 3.585 +/- 0.001 V
vOFS = -6.197 +/- 0.001 mV (beam blocked)
LOCKED = 47.6 +/- 0.2 mV
REFPD = 3.596 +/- 0.003 V
UNLOCK = 2.700 +/- 0.003 V
REFPD = 3.590 +/- 0.001 V
P_Inc = 19.36 +/- 0.001 mW
REFPD = 3.594 +/- 0.001 V
- Cavity coupling 0.980 (2.0% junk&sidebands)
- Cavity R&T: R=229ppm, T=0.970 (previous T=0.946, 2.4% UP!)
- OMC Throughput (Cavity T x First BS R): T=0.963
- Cavity loss per mirror 42.8 ppm / Round Trip Loss 238ppm
The Windows laptop for WincamD/Beam'R2 (DELL Vostro3300) was not functional.
- Windows 7 got stuck in the starting up process (Google "startup repair loop")
- The battery can't charge and the adapter connection is flaky
I decided to newly install Win10.
I made a new bootable Win10 DVD from the ISO downloaded from IMSS. The ISO file was converted to CDR using Disk Utility on Mac.
This deleted the past disk partitions. The installation process has no trouble and Win10 ran successfully. The machine is slow but still acceptable for our purpose.
Dataray Version 7.1H25Bk was downloaded from the vendor website https://dataray.com/blogs/software/downloads and installed successfully.
The devices ran as expected by connecting the heads and selecting the proper device in the software.
Then, the Win10 fell into "Hibernation Loop" and "Shutdown loop" (after disabling hibernation in the safe mode).
This is probably the combination of extremely slow windows update (feature update i.e. beta OS update) and the occasional shutdown due to the flakiness of the AC connection
Win10 was reinstalled and automatic Win update was disabled via windows policy manager or something like that. Still, it tries to download and update some of the updates (what's happening there!?
Here are my strong recommendations on how to use this laptop
Bond reinforcement blocks for the invar brackets:
The backscatter beam is supposed to appear in the backpropagation path. The transmission of the OMC has a couple of optics, it's not easy to access that beam.
To try to deflect the beam either horizontally or vertically, small optical pieces were made. (Attachment)
These are the combination of the optics
- Thorlabs PF05-03 Fused Silica Mirror Blank (dia12.7mm x t 6.0mm) + Thorlabs 1/2"sq BB Dielectric Mirror BBSQ05-E03
- Thorlabs PF05-03 Fused Silica Mirror Blank (dia12.7mm x t 6.0mm) + Thorlabs ME05-G01 Protected Al Mirror (dia12.7mm x t 3.2mm) + Thorlabs MRA10-K13 Right-Angle Prism Nd:YAG 10mm
Torr seal was used as the bonding epoxy. It uses a 1:2 volume mixture (not easy because of the viscosity) and is relatively fast to cure (in a couple of hours).
The test piece showed some softness after 3~4 hours so I left the parts cured overnight at room temp (i.e. 18degC)
The profile of the beam incident on the fiber input
The fiber input was deflected by a 45deg mirror. The beam profile was measured with WincamD. The beam was too strong (~60mW) even at the smallest pump power (ADJ -50) of the NPRO. So the two ND20 filters were added to the lens right before the 45 deg mirror and the camera.
The measured profile had some deviation from the nice TEM00 particularly around the waist. This could be a problem of the too small beam on the ND filter and the CCD.
This is not an issue as we just want to know the approximate shape of the beam.
For the fiber coupling, if we have the beam waist radius of ~200um it is sufficient for decent coupling.
Measure the power ratio between the forward-propagating and reverse-propagating beams.
- To increase the incident laser power, NPRO Current ADJ was set to be 0 (increased from -50)
- 1st: Without the baffle 0.373 +/- 0.001 uW / With the baffle 0.318 +/- 0.001 uW
- 2nd: Without the baffle 0.370 +/- 0.001 uW / With the baffle 0.318 +/- 0.001 uW
- 3rd: Without the baffle 0.370 +/- 0.001 uW / With the baffle 0.317 +/- 0.001 uW
==> 53.3 +/- 0.6 nW
- The main transmission was 84.0mW
==> Backpropagation ratio was 0.634+/-0.007 ppm
- Direct measurement of the OMC was after BS 96.6mW
==> Backpropagation power from the cavity: 61.3 +/- 0.7 nW
- Cavity transmission for the matched beam is Tcav RinputBS = 0.963
==> Incident resonant TEM00 power 100.3mW
- Reflection 61.3+/-0.7 nW x RinputBS = 60.8+/-0.7 nW
-> The effective reflectivity for the mode-matched resonant TEM00 beam incident on the OMC (1st steering mirror) is 0.606+/-0.007 ppm
SRS LCR meter SRS720 was returned to Downs as before.
OMC Reinforcement blocks
1. P/N D1600316; Version v4; Type 01; Qty 30; Source Chemistry Machine Shop
2. P/N D1600316; Version v4; Type 02; Qty 15; Source Chemistry Machine Shop
3. P/N D1600316; Version v4; Type 01; Qty 40; Source Resource MFG PO S422806
4. P/N D1600316; Version v4; Type 02; Qty 40; Source Resource MFG PO S422806
Stephen asked Srinath for the ICS entry.
Stephen made the C&B request https://cleanandbake.ligo.caltech.edu/clean_and_bake/request/1708/
Madeline was asked to take care of the C&B.
Also, the Torr Seal box was returned to Madeline.
More epoxy delamination check:
DCPD R (Attachment 1): Found half delaminated
DCPD T (Attachment 2): Found half delaminated
QPD1/QPD2 (Attachment 3): Looks fine
In total we need to fix bonding of three invar bases (including the one for the cable bracket)
- Installed the High QE PDs to OMC #002
Upon the installation, the legs of the PDs were cut by 3mm. Also, the tab of the PD could not be embedded in the DCPD housing. Therefore, the tabs were cut.
The alignment looked just fine. The weak reflections are directed to the black glass beam dumps.
- After the installation, the QEs were measured.
It is so confusing. So I decided to make the QE test setup.
Ophir RM9 with chopper (+/-5%): 8.97mW
Thorlabs S140C integrating sphere (+/-7%): 9.11mW
Thorlabs S130C PD power meter (+/-7%): 9.15mW
Thorlabs S401C thermal power meter (+/-3%): 8.90mW
So there looks ~3% discrepancy between S130C and S401C
Then tried to measure the QE of C1-03@Cage B3 with Ophir RM9
- Initial state: QE=0.95
- First FirstContact application: QE went up to 0.973
- Second FirstContact application: QE = 0.974, basically no change
- Calibrate the trans-impedance amp with Keithley
- Apply FC to B1-22 and B1-23 to see if there is an improvement
- The power should be measured with S401C because the accuracy seems better (+/-3%).
- Take photos of the PD FC process
General To Do:
- Backscatter test 2nd trial
- Start applying the first contact to the optical surfaces
- Beam dump cleaning
- Apply FC cap to the PDs
- Delamination repair (light side)
- Delamination repair (dark side)
- Cable bracket replace (dark side)
- 4 CLASS A wire clamp obtained from the OMC spare
- 4 more DIRTY wire clamp obtained from WB experiments (they no longer use these)
Once the later ones are C&Bed, we have enough.
- DLPCA-200 trans-impedance amplifier was calibrated.
Keithley source meter 2450 was connected to the amp. Provide current and read the output voltage with the precision digital voltage meter (Agilent/Keysight).
Gain: 999.7V/A@7mA, 999.6V/A@8mA
- From the power meter spec, Thorlabs S401C seemed the best (+/-3%). So the QEs of the 9 PDs were checked with this power meter again.
- All PDs exhibited the QE of 0.95~0.96. It's all relative as the power meter has a systematic error.
- Tried to clean B1-22 and B1-23 PDs. They didn't show significant improvement after the cleaning. To avoid the unnecessary risk of damaging the PDs, further cleaning was not performed. (Some photos were attached)
- What we can do is use this result as the relative measurements.
- For OMC#2, B1-22 is the DCPD(T) and B1-23 is the DCPD(R). C1-03 and C1-12 are the spares, according to this latest result.
- At LLO, we track down the source of the throughput reduction (-10%). The QEs of the PDs are going to be tested in the same setup at once to compare their PDs and our PDs.
The optical surfaces were coated with FirstContact to keep them clean / somewhat protected during the transportation.
The PD aperture was sealed with FirstContact "caps" (made by Kate in 2016?).
- D1300052-V3 SN001 is going to be used (Attachment 1)
- This is the PEEK version of the cable bracket (Attachment 2). The side thread holes have no Helicoils inserted. This needs to be done!
Connector arrangement check / cable routing check
Attachment 3: Connector Arrangement from the Northside
Attachment 4: Connector Arrangement from the South side
Attachment 5: Cable routing (Northside down)
At this point, the delamination of the V shape beam dumps was visible. This is the subject of bonding reinforcement.
- (Attachment 1) The connector nut rings were removed using an angled needle nose plier. The connector shell has a tight dimension relative to the hole on the bracket. But of course, they could be extracted.
- The 4 screws mounting the bracket to the invar blocks were successfully removed. No extra damage to the bonding.
- (Attachment 2) The plan was to remove the cable pegs by unfastening the button head 1/4-20 screws from the bracket and then just replace the bracket with the new one. However, these screws were really tight. The two were successfully removed without cutting the PEEK cable ties. Two cable ties were necessary to be cut to detach the bracket+pegs from the fragile OMC. Then one screw was removed. However, the final one could not be unfastened. This is not a problem as we are not going to recycle the metal cable bracket... as long as we have spare parts for the new bracket.
- (Attachment 3) Right now, the new bracket is waiting for the helicoils to be inserted. So the OMC lid was closed with the cables piled up. Just be careful when the lid is open.
Checking the spare parts
- Conclusion for OMC#2: need PEEK cable ties
- for more OMCs: need more BHCS / PEEK cable ties / Helicoils
Now we got the C&Bed parts to continue to work on the cable bracket replacement.
1) Helicoil insertion
1/4-20 Helicoils were inserted into the 6 thread holes of D1300052. It went mostly okay. We witnessed that the Helicoil insertion tool delaminated the plating of the Helicoils upon insertion (Attachment 1). Stephen mentioned that this is not usual, but we didn't find anything further such as increased friction, more debris, etc. So we decided to go forward.
2) EP30-2 Kit
The EP30-2 kit was transferred from the 40m clean room to the OMC lab. The EP30-2 kit tracking was updated via C1900343
3) D1300052 reinstallation -> FAIL
Now resumed to the installation of D1300052 bracket. However, the hole size of the bracket is just a bit too small compared with the size of the mighty mouse connectors. It was already quite tight with the metal version. However, this PEEK version seems to have 0.1 mm further small diameter, and then the connectors do not penetrate the holes. The plan could be
1) Use a razor blade to shave the hole inner circle.
2) Use a cleaned drill bit to make the hole size 0.2mm bigger.
- The hole size extension is going forwared now.
- Madeline and Chub are cleaning (sonicating) a drill (29/64=0.4531")
- The parts in a bag were brought to the 40m C&B lab.
- The hole is going to be 11mil=0.28mm larger than the recommendation (0.442").
It's not a D-hole. The connector has a rounded-rectangular flange that fits into the PEEK parts.
So I don't think it's an issue.
- Chub has a proper spanner to fasten the nuts. We want to use it here and LLO.
Today we tested the functionality of the four remaining PZTs (11,12,13 and 22) . Each PZT was placed within a collimated 500um beam.
Roughly half of the beam was blocked by the PZT. The PZT and a PD then acted as shadow sensor. Each PZT was tested with 0 and
150 V. The resulting power change then could be converted into a displacement of the PZT using the beam diameter.
The open light value for each of these tests was 3.25 V.
0 V supply voltage --> 1.717 V on PD
150 V supply voltage --> 1.709 V on PD
delta = 0.008 V
0 V supply voltage --> 1.716 V on PD
150 V supply voltage --> 1.709 V on PD
delta = 0.007 V
0 V supply voltage --> 1.702 V on PD
150 V supply voltage --> 1.694 V on PD
delta = 0.008 V
0 V supply voltage --> 1.770 V on PD
150 V supply voltage --> 1.762 V on PD
delta = 0.008 V
0.008 V --> 0.24% change in power on PD --> about 3.8 um displacement assuming no light which is blocked
by the PZT is hitting the PD.
We further started to drive all four PZTs over night with 100 V (half of their range) at 100 Hz.
We additionally display the impedance to ensure none of them degrades.
All four PZTs seem to be connected to Teflon coated wires. It needs to be checked if these
fulfill the vacuum compatibility requirements.
[Joe, Koji, Liyuan, Philip, Stephen]
Work done on 16.04.2019
Finishing assembly of transport box
Assembly worked fine except for the clamping structure to clamp the lid of the transport box to the bottom part.
It seemed that some of the plastic of these clamps became brittle during the baking. The plastic was removed and the
clamps where wiped clean. It appears that the clamps can't be locked as they should. Still the transport box should be fine
as the long screws will mainly clamp the two parts together.
Preparing the transport box to mount the breadboard
The lid of the the transport box was placed upside down and clamped to the table. All peak clamping structures where pulled back as far as possible.
Preparation and cleaning of the breadboard
We unpacked the breadboard and found lots of dust particles on it (most likely from the soft paper cover which was used). We used the ionized nitrogen gun
at 25 psi to get rid of the majority of particles and cross-checked with a bright green flash light before and after blowing. The second stage of cleaning was done
below the clean room tent and included the wiping of all surfaces. The breadboard was then placed into the prepared lid of the transport box and clamped with peak
Unpacking of the template
The previously cleaned template was unpacked while the last layer of coverage was removed below the cleanroom tent.
Template adjustment on the breadboard
All peak screws of the clamping structure of the template where removed. The template was placed onto the breadboard only seperated by peak spacers.
All peak screws have been inserted for horizontal clapming. A calipper was used to measure the distance of each edge of the template to the edge of the
breadboard. For documentation the labeled side of the bradboard (facing away from the persons on the pictures) of the upside down breadboard is defined to
be the south side, continuing clockwise with west, north and east. First rough alignment was done by shifting the template on the breadboard and then the
peak screws where used for fine tuning. The caliper values measured where:
North C 8.32mm E 8.52 mm W 8.41 mm
East C 8.08 mm
South C 8.32 mm
West C 8.02 mm
(E indicating east side position, W indicating west side position and C indicating center position)
ach[Joe, Phillip, Koji, Stephen]
Work from 17.04.2019
First contact cleaning of OMC optics
We cleaned the OMC optic with first contact. After a first cleaning run all mirrors except for two looked
fine. One had some first contact residuals on the left at center height and another had some particle sitting
near the center area. As the ionized nitrogen gun didn't help we applied another round of first contact which resolved
the two issues. Unfortutanely the second run of cleaning again left some residuals of first contact at the edges.
We were able to peal these off with tweezers.
Placement of Optics at the breadboard
We cleaned the contact surfaces for the bonds using optic wipes and pure isopropanol. The placement wen't well for 3 of the 5 optics (low number of newtonian rings).
One was recleaned and placed on the breadboard again which seemed fine. For the 5th no newtonian rings could be seen (either verry ood or bad) we planed on trying it in the current set-up. Mirrors used can be seen in attachment 3.
We took apart the unit removed from the 3rd IFO (Unit serial number aLIGO #3, XTAL 10252004) to see what makes it tick. Koji has done a fine job of adding the plots of the impedance data to this log book. Attached are some details of the physical construction showing the capacitor values used in shunt before the coils.
Attached please see my notes summarizing the models for the electrodes and inductors within the 3rd IFO EOM
Attached is a block diagram of the test setup used in the 40m lab to measure the modulation index of the IO modulator
Norna Robertson, Stephen Appert || 29 Nov 2017, 2 pm to 4 pm || 227 Downs, CIT
We made some preparations for modal testing, but did not have enough time to make measurements. Below is an after-the-fact log, including some observations and photos of the current state of the OMC bench.
Preparation for the PZT subassembly bonding (Section 6.2 and 7.3 of T1500060 (aLIGO OMC optical testing procedure)
- Gluing FIxture (Qty4)
- Silica Sphere Powder
- Electric scale
- Toaster Oven for epoxy mixture qualification
- M prisms
- C prisms
- Noliac PZTs
- Cleaning tools (forceps, tweezers)
- Bonding kits (copper wires, steering sticks)
- Thorlabs BA-2 bases Qty2
- Razor Blades
Also brought to the 40m on 10 April, in preparation for PZT subassembly bonding:
- new EP30-2 epoxy (purchased Jan 2019, expiring Jul 2019 - as documented on documents attached to glue, also documented at C1900052.
- EP30-2 tool kit (maintained by Calum, consisting of mixing nozzles, various spatulas, etc)
Already at the 40m for use within PZT subassembly bonding:
- "dirty" ABO A with temperature controller (for controlled ramping of curing bake)
- clean work areas on laminar flow benches
- Class B tools, packaging supplies, IPA "red wipes", etc.
Upon reviewing EP30-2 procedure T1300322 (current revision v6) and OMC assembly procedure E1300201 (current revision v1) it appears that we have gathered everything required.
[Stephen, Philip, Koji, Joe]
Breadboard D1200105 SN06 was selected as described in eLOG 338. This log describes unwrapping and preparation of the breadboard.
Relevant procedure section: E1300201 section 6.1.5
Breadboard was unwrapped. No issues observed during unwrapping.
Visual inspection showed no issues observed in breadboard - no large scratches, no cracks, no chipping, polished area (1 cm margin) looks good.
Initially the breadboard has a large amount of dust and fiber from the paper wrapping. Images were gathered using a green flashlight at grazing incidence (technique typical of optic inspection).
PROCEDURE IMPROVEMENT: Flashlight inspection and Top Gun use should be described (materials, steps) in E1300201.
Top gun was used (with medium flow rate) to remove large particulate. Breadboard was placed on Ameristat sheet during this operation.
Next, a clean surface within the cleanroom was protected with Vectra Alpha 10 wipes. The breadboard, with reduced particulate after Top Gun, was then placed inside the cleanroom on top of these wipes. Wiping with IPA Pre-wetted Vectra Alpha 10 wipes proceeded until the particulate levels were acceptable.
Joe and Koji then proceeded with placing the breadboard into the transport fixture.
As mentioned in eLOG 331, either increased thermal cycling or apparent improvements in cured EP30-2 strength led to fracture of curved mirrors at unintended locations of bonding to the PEEK fixture parts.
The issue and intended resolution is summarized in the attached images (2 different visualizations of the same item).
Redline has been posted to D1600336-v3.
Drawing update will be processed shortly, and parts will be modified to D1600336-v4.
Summary: Beginning on 20 May 2019, two CM PZT assemblies were soaked in Acetone in an effort to debond the EP30-2 bonds between tombstone-PZT and between PZT-optic. Debonding was straightforward after 8 days of soaking. 24 hours of additional acetone soaking will now be conducted in an attempt to remove remnant EP30-2 from bonding surfaces.
Procedure: The assemblies were allowed to soak in acetone for 8 days, with acetone level below the HR surface of the optic. No agitation of the solution, mechanical abrasion of the bond, or other disturbance was needed for the bond to soften.
GariLynn contributed the glassware and fume hood, and advised on the process (similar to debonding of CM and PZT from OMC SN002 after damaging event). The equipment list was (WIP, more detail / part numbers will be gathered today and tomorrow):
Results: Today, 28 May 2019, I went to the lab to check on the optics after 8 days of soaking. Liyuan had monitored the acetone level during the first 4 days, topping up once on 24 May. All bonds were fully submerged for 8 days.
There were 2 assemblies soaked in one crystallizing dish. Debonded assemblies - ref OMC eLOG 328 for specified orientations and components:
PZT Assy #9 - ref. OMC eLOG 334 - M17+PZT#12+C10
PZT Assy #7 - ref. OMC eLOG 332 - M1+PZT#13+C13
PZT Assy #7 was investigated first.
A video of removal of C10 and PZT#12 from PZT Assy #9 was collected (See Attachment 8), showing the ease with which the debonded components could be separated.
Photos and video have been be added to supplement this report (edit 2019/07/08).