I handed Camille the C7 mirror for the cross-calibration of the ROC characterization techniques.

[LiyuanZ, StephenA]

Downs B119

Summary: Beginning on 20 May 2019, two CM PZT assemblies were soaked in Acetone in an effort to debond the EP30-2 bonds between tombstone-PZT and between PZT-optic. Debonding was straightforward after 8 days of soaking. 24 hours of additional acetone soaking will now be conducted in an attempt to remove remnant EP30-2 from bonding surfaces.

Procedure: The assemblies were allowed to soak in acetone for 8 days, with acetone level below the HR surface of the optic. No agitation of the solution, mechanical abrasion of the bond, or other disturbance was needed for the bond to soften.

GariLynn contributed the glassware and fume hood, and advised on the process (similar to debonding of CM and PZT from OMC SN002 after damaging event). The equipment list was (WIP, more detail / part numbers will be gathered today and tomorrow):

• crystallizing dish (no spout, like a deep petri dish)
• curved lid
• wax sheet (to seal)
• acetone
• fume hood

Results: Today, 28 May 2019, I went to the lab to check on the optics after 8 days of soaking. Liyuan had monitored the acetone level during the first 4 days, topping up once on 24 May. All bonds were fully submerged for 8 days.

There were 2 assemblies soaked in one crystallizing dish. Debonded assemblies - ref OMC eLOG 328 for specified orientations and components:

PZT Assy #9 - ref. OMC eLOG 334 - M17+PZT#12+C10

PZT Assy #7 - ref. OMC eLOG 332 - M1+PZT#13+C13

PZT Assy #7 was investigated first.

• C13 was removed with no force required.
• PZT#13 was removed with no force required.
• EP30-2 remained at the bond surfaces and tracing the diameters of each bond on each of the 3 bonding surfaces of the PZT and tombstone - these components were returned to the dish to soak.
• No EP30-2 remained on the surface of the curved mirror - C13 was removed and stored.

A video of removal of C10 and PZT#12 from PZT Assy #9 was collected (See Attachment 8), showing the ease with which the debonded components could be separated.

• C10 was removed with no force required.
• A slight force - applied by gripping the barrel of the PZT and pushing with the index finger on the surface of the tombstone - was required to separate PZT#12 from M17,
  • likely due to excess glue at the barrel of the PZT
• EP30-2 remained at the bond surfaces and tracing the diameters of each bond on each of the 3 bonding surfaces of the PZT and tombstone - these components were returned to the dish to soak.
• No EP30-2 remained on the surface of the curved mirror - C13 was removed and stored.

Photos and video have been be added to supplement this report (edit 2019/07/08).

Yesterday Jeff and Chub worked on the cabling of the OMC. It turned out that the gender of the cable connectors
going from the cavity side to the connector bracket on top of the OMC were opposite from what is needed. 
This way, the connectors can't fixed on the cable harness, thus they are free during the shipping.

We considered several ideas to mitigate this issue and decided to swap the gender of the Mighty Mouse connectors.

In order to check this operation may cause the shortage of the cable length, we made the fitting of the cables.
They seem all long enough for Chub to replace the Mighty Mouse connectors with the proper gender. 

We also checked the polarity of the PZT wires. We marked the positive side of the PZT by a knot at the wire end.

We attached fused silica windows on the test PZTs. http://nodus.ligo.caltech.edu:8080/OMC_Lab/93

The glued assemblies were brought to Bob's bake lab for the heat cure. There they are exposed to 94degC heat for two hours (excluding ramp up/down time).

After the heat cure, we made the visual inspection.
The photos are available here.

Pre-bake
Test PZT #1: 17.4nm/V
Test PZT #2: 17.2nm/V
Test PZT #3: 30.6nm/V

Post-bake
Test PZT #1: 27.2 nm/V
Test PZT #2: 26.9 nm/V
Test PZT #3: 21.4 nm/V

Measurement precision is ~+/-20%
Spec is 14nm/V

We want to make sure the responses of the PZT actuator does not change after the EP30-2 gluing.

A shadow sensor set up was quickly set-up at the fiber output. It turned out the ring PZTs are something really not-so-straightforward.
If the PZT was free or just was loosely attached on a plane by double-sided tape, the actuation response was quite low (30% of the spec).
After some struggle, I reached the conclusion that the PZT deformation is not pure longitudinal but some 3-dimensional, and you need to
use a "sandwitch" with two flat surfaces with some pressue.

I turned the setup for horizontal scans to the vertical one, and put the PZT between quarter-inch spacers.
Then two more spacers are placed on the stack so that the weight applies the vertical pressure on the PZT.
This is also use ful to adjust the height of the shadow.

The calibration plot is attached. It gives us ~21k V/m.
Voltage swing of 150V results the output voltage change of ~50mV.  This is pretty close to what is expected from the spec (16nm/V).
The PZT#3 (which had the mirror glued on) showed significantly large response.

Test PZT #1: 17.4nm/V
Test PZT #2: 17.2nm/V
Test PZT #3: 30.6nm/V
UHV PZT #24: 17.6nm/V

These numbers will be checked after the heat cure of EP30-2

C30665 (3mm) camera test. The camera was Canon PowerShot G7X MkII. Exposure 1/15s, F 5.6, ISO 125, MF (~the closest), no zoom.
This image was taken before the beam illumination. Will tune the green lighting to have some gradient on the surface so that we can see any deformation of the surface.

This is the analysis of the cavity finesse data taken on  Apr/13/2013 (before baking), May/30/2013 (after baking), and Jun/02/2013 (after cleaning).
If we believe this result, baking contaminated the cavity, and the first contact removed it. That agrees with the power measurement of the transmitted light.

BS1/FM1/FM2 for I1OMC were glued.

FM1 had to be intentionally rotated.
FM1 had to be intentionally shifted to avoid scattering spot.

Pin: 36.3 / Ptrans: 33.7 = Raw transmission 92.8%
Vunlock = 6.30 / Vlock = 0.120

Mode matching (estim) 0.98
Loss per mirror 84ppm
Cavity transmission 0.947

ummm

Tomorrow:
- Transmission needs to be optimized
- Apply 50V to a PZT
- Cavity FSR/HOM should be optimized
- gluing

Put a cover
Return power meter / DC supply

Clean supplies & some cleaning tools are located at the right side of the entrance.
The file cabinet there was moved to the left side of the door, but will be removed eventually.

ach[Joe, Phillip, Koji, Stephen]

Work from 17.04.2019

First contact cleaning of OMC optics
We cleaned the OMC optic with first contact. After a first cleaning run all mirrors except for two looked
fine. One had some first contact residuals on the left at center height and another had some particle sitting
near the center area. As the ionized nitrogen gun didn't help we applied another round of first contact which resolved
the two issues. Unfortutanely the second run of cleaning again left some residuals of first contact at the edges.
We were able to peal these off with tweezers.

Placement of Optics at the breadboard
We cleaned the contact surfaces for the bonds using optic wipes and pure isopropanol. The placement wen't well for 3 of the 5 optics (low number of newtonian rings).
One was recleaned and placed on the breadboard again which seemed fine. For the 5th no newtonian rings could be seen (either verry ood or bad) we planed on trying it in the current set-up. Mirrors used can be seen in attachment 3.

 

L1 OMC Cavity power budget

H1 OMC Cavity power budget

3IFO OMC Cavity power budget

Conclusion on the cleaning of OMC #001

- After a couple of first contact cleaning trials and deep cleaning, the total loss was measured to be 0.045+/-0.004.
  This indicated a slight improvement from the loss measured at LLO before any cleaning (0.064+/-0.004).
  However, the number did not improve to the level we marked in 2013 (0.028+/-0.004).

- This loss level of 4.5% is comparable to the loss level of OMC #3, which is currently used at LHO.
  Therefore, this OMC #1 is still a useful spare for the site use.

- Some notes / to-do regarding this unit:
  1) The beam dump with melted black glass was removed. A new beam dump needs to be bonded on the base.
  2) The connector bracket still needs to be replaced with the PEEK version.
  3) The PZT of CM1 has been defunct since 2013. Combining LV and HV drivers is necessary upon use at the site. (LLO used to do it).

May
Tue 14th The OMC given to Bob (Air bake & Vac bake)

Mon 20th The OMC received from Bob
         Apply First contact
         Diode mount adjustment / Electronic tests
Tue 21st Diode mount adjustment / Electronic tests / Optical tests
Wed 22nd Final cabling (***Chub***)
Thu 23rd Final cabling / Packing
Fri 24th Packing / Shipping

Mon 27th? Arrival to LLO / Koji fly to LLO
Tue 28th Test on the optical bench
Wed 29th Test on the optical bench
Thu 30th Suspension test? (***Jeff B***)

June
Tue  4th Suspension test done?

- The wrong Mighty Mouse connectors for the PZT wires were prepared. The correct ones are in the vacuum oven till Tuesday morning.

- The thread holes for the cable pegs are 1/4-20 rather than 10-24.  This requires re-machining of the cable pegs & the C&B.

- We are waiting for the fast shipment of the from LHO

May
Thu 23rd Diode mount adjustment / Optical tests
Fri 24th Optical tests
Tue 28th Mighty mouse connector available / Diode mounting finalization
Wed 29th final check
Thu 30th shipment
Fri 31th

June
Mon  3rd ? Arrival to LLO / Koji fly to LLO
Tue  4th Suspension test done?

Power Supply Board D0900848 was oscillating. Here is the procedure how the issue was fixed.

PCB schematic: LIGO DCC D0900848

0. Extracting the power board.

The top lid and the front panel were removed. Top two modules were removed from the inter-board connection.
Some of the SMA cables were necessary to be removed to allow me to access to the botttom power board.

1. D1~D4 protection diodes

Daniel asked me to remove D1, D2, D3, D4 as the power supply sequence is controlled by the relays.
This was done.

2. Power supply oscillation
Since the power supply systems are entagnled, the oscillation of the transister boosted amps had to be checked one by one.

2.1 VREFP (U5)

First of all, the buffering stage of the positive voltage reference (U5) was oscillating. Attachment 1 is the observed voltage at "VREFP" at D13.
The oscillation was at 580kHz with 400mVpp. This was solved by replacing C20 with 1.2nF. (0805 SMD Cap)

2.2 VREFN (U6)

Then the buffering stage of the negative voltage reference (U6) was checked. Attachment 2 is the observed voltage at "VREFN" at D16.
The oscillation was at 26MHz with 400mVpp. This seemed to have a different mechanism from the U5 oscillation. This oscillation frequency is
higher than the GBW of OP27. So there must be some spurious path to the transister stage. This amplifier stage is a bit unique.
The input is VREFP, but the positive supply is also VREFP. And the feedback path between R31 and C24 is very long. I was afraid that this oscillation
was caused by some combination of L and stray C by the long feedback path and the output to power VREFP coupling, although I could not reproduce
the oscillation on LTSpice. 

After some struggles, adding a 100pF cap between the output of U6 op27 (PIN6) and VREFP (PIN7) stopped the oscillation.
I think this changes the loop function and fullfills the stability condition. I confirmed by a LTSpice model that additional cap does not
screw up the original function of the stage at audio frequencies when everything is functioning as designed.

2.3 Positive supply systems (U10, U11, U12)

Even after fixing the oscillations of U5 and U6, I kept observing the oscllative component of ~600kHz at U10 (+21V), U11 (+15V), and U12 (+5V) stages.
Among them, U11 had the biggest oscillation of 400mVpp at the opamp out (Attachment 3). The other two had small oscillation like 20mVpp at the opamp outputs.
The solution was the same as 2.1. C50, C51, and C52 were replaced to 1.2nF. After the modification I still had the 600kHz component with 2mVpp.
I wanted to check other channels and come back to this.

2.3 Negative supply systems (U7, U8, U9)

Similarly the outputs of U7, U8, and U9 had the oscillation at 600kHz with 40~80mVpp. Once C35, C36, and C37 were replaced with 1.2nF,
I no longer could see any 600kHz anywhere, including U10~U12.

2.4 -24V system (U13)

Last modification was U13. It had a noise of 50mVpp due to piled-up random pulses (Attachment 4). I just tried to replace C63 with 1.2nF
and remove a soldering jumber of W1. There still looks random glitches there. But it's no longer the round shaped pulses but a sharp gliches
and the amplitude is 20mV each (Attachment 5). In fact, later I noticed that Q9 is not stuffed and W2 is closed. This means that the +24V external supply is
directly connected to +24AMP. Therefore U13 has no effect to the 24V suppy system.

3. Restoring all connections / final check of the voltages

Restore the middle and top PCBs to the intra-PCB connector board. Attach the front panel. Restore the SMA connections.

The missing soldering of the SMA cable (reported in the previous entry) was soldered.

Once all the circuits are connected again, the power supply voltages were checked again. There was no sign of oscillation.

All the above modifications are depicted in Attachment 6.

D1102211 OMC Diode Mount Glass Block (11pcs) have been given to Calum@Downs

Attachment 1: System diagram. The reverse bias voltage is controlled by DS335. This can produce a voltage offset up to 10V. A G=+2 opamp circuit was inserted so that a bias of up to +15V can be produced. The capacitances of the photodiodes were measured with SR720 LCR meter with a probe. DS335 and SR720 were controlled from PC/Mac via serial connections.

Attachment 2: Overview

Attachment 3: How was the probe attached to the photodiode under the test

Attachment 4: The bias circuitry and the power supply

Attachment 5: G=+2 amp

Measurement result:

The capacitance at no bias was 460~500pF. This goes down to below 300pF at 1.0~1.5V reverse bias. At maximum +15V, the capacitance goes down to 200~220pF.

On this opportunity, the capacitances of a couple of Excelitas C30665 photodiodes were measured. In Attachment 2, the result was compared with one of the results from the high QE PDs. In general the capacitance of C30665 is lower than the one from the high QE PDs.

We want to perform a damage test of OMC DCPDs with high power beam. The OMC DCPD is the 3mm InGaAs photodiodes with high quantum efficiency, delivered by Laser Components.
The sites want to know the allowed input power during the OMC scan for beam mode analysis. The nominal bias voltage of the PDs is +12V. Therefore, 30mA of photocurrent with the transimpedance of 400 Ohm is already enough to saturate the circuit. This means that the test is intended to check the damage of the photodiode mainly by the optical power.

The test procedure is as follows:

1. Illuminate the diode with certain optical power.
2. Measure the dark current and dark noise of the PD with no light on it.
3. Check the condition of the PD surface with a digital camera.
4. Repeat 1~3 with larger optical power.

The beam from an NPRO laser is delivered to the photodiode. The maximum power available is 300~400mW. The beam shape was regulated to have the beam radius of ~500um.

- When the PD is exposed to the high power beam, the circuit setup A) is used. This setup is intended to mimic the bias and transimpedance configuration used in the DCPD amp at the site.

- When the dark noise is measured, the circuit setup B) is used. This setup is low noise enough to measure the dark noise (and current) of the PD.

- The test procedure is going to be tested with an Excelitas 3mm InGaAs PD (C30665), and then tested with the high QE PD.

Inserted 4-40 and 2-56 helicoils into the DCPD/QPD housings for the 4th OMC. The retainer caps were also fastened to the housings.

[Jeff, Koji]

DCPD path gluing

Usual preparation

- Locked the cavity.

- Aligned the input beam to the cavity

DCPD BS gluing

- Placed the DCPD BS on the breadboard

- Placed the dummy DCPD mount on the reflection side of the BS. Check the height and position of the spot.

- Placed the dummy DCPD mount on the transmission side of the BS. Check the height and position of the spot.

- The spot positions looked fine.

- Added a dub of UV glue on the BS. Placed it along the fixture.

- Checked the reflection spot again with the CCD. Kept monitored the spot position through out the gluing process
of the BS.

- Blasted the UV illumination

Reflection side beam dump gluing

- Replaced the alignment disk of the dummy DCPD with a photodiode with the cap removed.

- Put the dummy DCPD mount and the beam dump in place

- Checked the reflection spot from the diode on the beam dump. It looked fine.

- Applied 2~3 dubs of the glue on the beam dump. Slid in the dump to the fixture.

- Applied UV illumination. As the beam dump shadows the illumination 3 times of 10sec blasts were applied.

Transmission side beam dump gluing

- Put the dummy DCPD mount with the diode in place

- Put the beam dump in place. The template needed to be lifted up a bit to accomplish this action.
This should be fixed by the modification of the template.

- Checked the transmission spot on the diode and the spot reflected from the diode on the beam dump.

- Actually the spot was too much close to the vertex of the "V" on the beam dump. We determined that
this was mainly caused by the misalignment of the diode element, and can be compensated by the tilt of the diode mount.

- Removed the beam dump from the template once. Applied 2~3 dubs of the glue on the beam dump.
Slid in the dump to the fixture by lifting up the template again.

- Applied UV illumination. As the beam dump shadows the illumination 3 times of 10sec blasts were applied.

Mounting bracket gluing

- Glued the mounting brackets for the DCPD mounts based on the positions specified by the template.

Removing the templates

- Removed the connection bars between the two templates.

- Removed the template at the QPD side. The screws at all of the three sides were needed to be released in order to accomplish this action.
Once the screws are released, the template was slid on the breadboard so that the pads did not scratch the optical surface.
Keep one side of the template use as a pivot, lifted up another side until the pads clear the optic. Then lifted up the other side.

- Removed the other template. This time, the screws at the two DCPD sides are released. The template was slid and lifted in a same way.

Last beam dump gluing

- Once the QPD side template was removed, the last beam dump at the transmission side of the first steering mirror was glued.

- This has been done without any gluing fixture, we held the beam dump with clean Allen keys on the breadboard.

- The paths for the main and stray beams were confirmed by an IR sensor card, and blasted the UV.

Closing the transport fixture

- Removed the constraining pins for the breadboard.

- Made sure all of the constraining pins/screws are released for the other side of the transport fixture were released.

- Put the lid on.

- Fastened the constraining pins/screws of the transport fixture.

- Wrapped the fixture with sheets of the Al foil.

- Pack the fixture in anti-static bags.

DCPD mounts and QPD mounts were attached on the breadboard. They are not aligned yet and loosely fastened.

DCPD (mounting 4-40x5/16 BHCS Qty4)

Face plates fatsened by 4-40x5/16 BHCS (24 out of 40)

Housing   Face plate Destination  PD
002       002        L1OMC DCPD1  #10
003       003        L1OMC DCPD2  #11
004       004        H1OMC DCPD1
008       005        H1OMC DCPD2
009       006        I1OMC DCPD1
010       007        I1OMC DCPD2


QPD (mounting 4-40x5/16 BHCS Qty4)

Face plates fatsened by 4-40x1/4 BHCS (24 out of 80)

Housing   Face plate Destination QPD
002       002        L1OMC QPD1  #38 #43 swapped on 29th May.
003       003        L1OMC QPD2  #43 #38 swapped on 29th May.
004       004        H1OMC QPD1
005       005        H1OMC QPD2
006       006        I1OMC QPD1
007       007        I1OMC QPD2

* 4-40x5/16 BHCS Qty 8 left
* 4-40x5/16 BHCS Qty 56 left

Cut the diode legs by 3mm

Dark current measurement for InGaAs QPDs (OSI FCI-InGaAs-Q3000) has been done using Keithley 2450 and Frank's diode test kit. Frank's setup uses various custom instruments which are no longer exist, therefore the kit was used only for switching between the segments.

The diodes were serialized as 81, 82, 83, 84, continuing the numbering for the OMC QPDs. The numbers are engraved at the side and the back of the diode cans.

Overall, the QPDs nominally indicated the usual dark current level of <10nA.
SEG1 of #82 showed a lower voltage of reverse breakdown but this is not a critical level.
#83 showed variations between the segments compared to the uniform characteristics of #81 and #84.

Dark current of the HQE PD and other PDs were measured.

- The HQE PDs were loaded on the new PD transportation cages (Attachment 1)
The PDs are always shorted by a clean PD plugs. The PD element is still capped with Kapton seals.

- The assignment of the container/slot and the PDs are as follows

- The measurement has been done with KEITHLEY sourcemeter SMU2450.

- The result is shown in Attachment 2. Most of the PDs show the dark current of ~3nA at 15V bias. C1-05 and C1-07 showed higher dark current at high V region. We should avoid using them for the aLIGO purpose. I hope they are still OK at low bias V if there is no noise issue (TBC). You can not read the PD names on the plot for the nominal ones, but that's OK as they are almost equivalent.

- As a comparison, the dark current of a C30655 (serial #10) was measured. Considering a DC current due to an anbient light (although the PD was covered), the dark current of the HQE PD seems double of C30655.

- Taking an advantage of having the setup, I took the same measurement for the Laser Comp. PDs in ATF. I gave the identification as #1 and #2. #1 has full-length legs while #2 has trancated legs. As Zach reported before, they showed significantly high dark current. (Attachment 3)

Transfered for RGA scan

B4 (C1-05) -> F1
C1 (C1-07) -> F2

[Camille, Thejas]

We repeated Zygo measurements (using the same setup and method as below) for curved mirrors sn07, sn11, sn12, sn18, sn19, sn25, sn26, and sn30.

sn11 and sn25 still show a large spread in angular measurements (see attached.) This is attributed to the low decentering values for these two mirrors (0.072mm and 0.158mm, respectively).

Attached here with are relevant plots.

The dimensions of a high QE PDs was measured as well as the ones for C30665. (Attachment 4, Unit in mm)
They seemed to be very much compatible.

The PDs came with the designated case (Attachment 1). The bottom of the case has a spongy (presumably conductive) material.

Diodes have no window. Each came with an adhesive seal on it. (Attachment 2)
There is a marking of a serial at the side.

I opened one (Attachment 3). The sensitive area looks just beautiful. The seal was reapplied to avoid possible contamination.

Quantum efficiencies of the C30665GH diodes were measured. 

- The diode was biased by the FEMTO preamplifier.

- Diode Pin 1 Signal, Pin 2 +5V, Pin 3 open

- Preamp gain 10^3 V/A

- Beam power was measured by the thorlabs power meter.

PD #1
Incident: 12.82 +/- 0.02 mW
Vout: 9.161 +/- 0.0005 V
PD Reflection (Prompt): 0.404 mW
PD Reflection (Total): 1.168 mW

PD #2
Incident: 12.73 +/- 0.02 mW
Vout: 9.457 +/- 0.0005 V
PD Reflection (Prompt): 0.364 mW
PD Reflection (Total): 0.937 mW

PD #3
Incident: 12.67 +/- 0.02 mW
Vout: 9.1139 +/- 0.01 V
PD Reflection (Prompt): 0.383 mW
PD Reflection (Total): 1.272 mW

PD #4
Incident: 12.71 +/- 0.02 mW
Vout: 9.3065 +/- 0.0005 V
PD Reflection (Prompt): 0.393 mW
PD Reflection (Total): 1.033 mW

PD #5
Incident: 12.69 +/- 0.02 mW
Vout: 9.1071 +/- 0.005 V
PD Reflection (Prompt): 0.401 mW
PD Reflection (Total): 1.183 mW

PD #6
Incident: 12.65 +/- 0.02 mW
Vout: 9.0310 +/- 0.01 V
PD Reflection (Prompt): 0.395 mW
PD Reflection (Total): 1.306 mW

PD #7
Incident: 12.67 +/- 0.02 mW
Vout: 9.0590 +/- 0.0005 V
PD Reflection (Prompt): 0.411 mW
PD Reflection (Total): 1.376 mW

PD #8
Incident: 12.63 +/- 0.01 mW
Vout: 9.0790 +/- 0.0005 V
PD Reflection (Prompt): 0.420 mW
PD Reflection (Total): 1.295 mW

PD #9
Incident: 12.67 +/- 0.02 mW
Vout: 9.2075 +/- 0.0005 V
PD Reflection (Prompt): 0.384 mW
PD Reflection (Total): 1.091 mW

PD #10
Incident: 12.70 +/- 0.01 mW
Vout: 9.0880 +/- 0.001 V
PD Reflection (Prompt): 0.414 mW
PD Reflection (Total): 1.304 mW

PD #11
Incident: 12.64 +/- 0.01 mW
Vout: 9.2861 +/- 0.0005 V
PD Reflection (Prompt): 0.416 mW
PD Reflection (Total): 1.152 mW

PD #12
Incident: 12.68 +/- 0.02 mW
Vout: 9.3650 +/- 0.001 V
PD Reflection (Prompt): 0.419 mW
PD Reflection (Total): 1.057 mW

PD #13
Incident: 12.89 +/- 0.01 mW
Vout: 9.3861 +/- 0.001 V
PD Reflection (Prompt): 0.410 mW
PD Reflection (Total): 1.047 mW

PD serial number
 1 - 0782
 2 - 1139
 3 - 0793
 4 - 0732
 5 - 0791
 6 - 0792
 7 - 0787
 8 - 0790
 9 - 0781
10 - 0784
11 - 1213
12 - 1208
13 - 1209

{
  {1, 12.82, 9.161, 0.404, 1.168},
  {2, 12.73 , 9.457, 0.364 , 0.937} ,
  {3, 12.67 , 9.1139, 0.383 , 1.272 },
  {4, 12.71 , 9.3065, 0.393 , 1.033 },
  {5, 12.69, 9.1071, 0.401 , 1.183 },
  {6, 12.65, 9.0310, 0.395 , 1.306} ,
  {7, 12.67, 9.0590, 0.411 , 1.376} ,
  {8, 12.63 , 9.0790, 0.420 , 1.295} ,
  {9, 12.67 , 9.2075, 0.384 , 1.091} ,
  {10, 12.70, 9.0880, 0.414 , 1.304 },
  {11, 12.64 , 9.2861, 0.416 , 1.152} ,
  {12, 12.68 , 9.3650, 0.419 , 1.057} ,
  {13, 12.89 , 9.3861, 0.410 , 1.047}
};

Diode testing

o Purpose of the measurement

- Test Si QPDs (C30845EH) for ISC QPDs Qty 30 (i.e. 120 elements)

- Test InGaAs PDs (C30665GH) for OMC Qty 10 (i.e. 10 elements)

o Measurement Kit

- Inherited from Frank.

- Has relays in it.

- D0 and D1 switches the measurement instrument connected to an element

- D2 and D3 switches the element of the QPDs

- Digital switch summary

d0 d1 0 0 - ln preamp
d0 d1 1 0 - dark c
d0 d1 0 1 - omc preamp
d0 d1 1 1 - impedance

d2 d3 0 0 - A x x x
d2 d3 1 0 - C x o x
d2 d3 0 1 - B o x o
d2 d3 1 1 - D o o o

- The universal board in the box is currently configured for C30845.
  Pin1 - Elem A. Pin3 - B, Pin7 - C, Pin9 - D, Pin 12 - Case&Bias

o Labview interface

- Controls NI-USB-6009 USB DAQ interface and Agilent 82357B USB-GPIB interface

o Dark current measurement

- Borrowed Peter's source meter KEITHLEY 2635A

- For C30845GH the maxmum reverse bias is set to -20V. This drops the voltage of the each element to the bias voltage.

o Spectrum measurement

- The elements are connected to FEMTO LN current amp DLPCA-200.

- Bias voltage is set to +10V. This lifts up the outside of the amplifier input to +10V.

o Impedance measurement

- Agilent 4395A at PSL lab with impedance measurement kit

- For C30845GH the maxmum reverse bias is set to -15V. This drops the voltage of the each element to the bias voltage.

- Calibration: open - unplug the diode from the socket, short - use a piece of resister lead, 50Ohm - a thin metal resister 51Ohm

- Freq range: 30-50MHz where the response of the cables in the setup is mostly flat.

- Labview VI is configured to read the equivalent circuit parameters in the configuration "D" (series LCR).

- Labview fails to read the series resistance. This was solved by first read the equiv circuit param and then read it with Sim F-CHRST.
  F-CHRST does nothing on the parameters so the second request successfully acquires the first ones.

- For the dark noise measurement, the lid of the die-cast case should also contact to the box for better shielding. This made the 60Hz lines almost completely removed, although unknown 1kHz harmonics remains.

- The precise impedance of the setup can not be obtained from the measurement box; the cable in between is too long. The diode impedance should be measured with the impedance measurement kit.

- With the impedance measurement kit, the bias voltage of +5V should be used, in stead of -5V.

- diode characteristics measured at 10-100MHz

- Typical impedance characteristics of the diodes

Excelitas (Perkin-Elmer) C30665GH Rs=9Ohm, Cd=220pF, L=0~1nH (Vr=5V)

Excelitas (Perkin-Elmer) C30642G Rs=12Ohm, Cd=100pF, L=~5nH (Vr=5V) longer thin wire in a can?

Excelitas (Perkin-Elmer) C30641GH Rs=8Ohm, Cd=26pF, L=12nH (Vr=5V) leg inductance? (leg ~30mm)

- PD serial

C30665GH, Ls ~ 1nH

  1 - 0782 from PK, Rs=8.3Ohm, Cd=219.9pF
  2 - 1139 from PK, Rs=9.9Ohm, Cd=214.3pF
  3 - 0793 from PK, Rs=8.5Ohm, Cd=212.8pF
  4 - 0732 from PK, Rs=7.4Ohm, Cd=214.1pF
  5 - 0791 from PK, Rs=8.4Ohm, Cd=209.9pF
  6 - 0792 from PK, Rs=8.0Ohm, Cd=219.0pF
  7 - 0787 from PK, Rs=9.0Ohm, Cd=197.1pF
  8 - 0790 from PK, Rs=8.4Ohm, Cd=213.1pF
  9 - 0781 from PK, Rs=8.2Ohm, Cd=216.9pF
10 - 0784 from PK, Rs=8.2Ohm, Cd=220.0pF
11 - 1213 from the 40m, Rs=10.0Ohm, Cd=212.9pF
12 - 1208 from the 40m, Rs=9.9Ohm, Cd=216.8pF
13 - 1209 from the 40m, Rs=10.0Ohm, Cd=217.5pF

C30642G, Ls ~ 12nH

20 - 2484 from the 40m EG&G, Rs=12.0Ohm, Cd=99.1pF
21 - 2487 from the 40m EG&G, Rs=14.2Ohm, Cd=109.1pF
22 - 2475 from the 40m EG&G glass crack, Rs=13.5Ohm, Cd=91.6pF
23 - 6367 from the 40m ?, Rs=9.99Ohm, Cd=134.7pF
24 - 1559 from the 40m Perkin-Elmer GH, Rs=8.37Ohm, Cd=94.5pF
25 - 1564 from the 40m Perkin-Elmer GH, Rs=7.73Ohm, Cd=94.5pF
26 - 1565 from the 40m Perkin-Elmer GH, Rs=8.22Ohm, Cd=95.6pF
27 - 1566 from the 40m Perkin-Elmer GH, Rs=8.25Ohm, Cd=94.9pF
28 - 1568 from the 40m Perkin-Elmer GH, Rs=7.83Ohm, Cd=94.9pF
29 - 1575 from the 40m Perkin-Elmer GH, Rs=8.32Ohm, Cd=100.5pF

C30641GH, Perkin Elmer, Ls ~ 12nH

30 - 8983 from the 40m Perkin-Elmer, Rs=8.19Ohm, Cd=25.8pF
31 - 8984 from the 40m Perkin-Elmer, Rs=8.39Ohm, Cd=25.7pF
32 - 8985 from the 40m Perkin-Elmer, Rs=8.60Ohm, Cd=25.2pF
33 - 8996 from the 40m Perkin-Elmer, Rs=8.02Ohm, Cd=25.7pF
34 - 8997 from the 40m Perkin-Elmer, Rs=8.35Ohm, Cd=25.8pF
35 - 8998 from the 40m Perkin-Elmer, Rs=7.89Ohm, Cd=25.5pF
36 - 9000 from the 40m Perkin-Elmer, Rs=8.17Ohm, Cd=25.7pF

Note:
  1mm Au wire with dia. 10um -> 1nH, 0.3 Ohm
20mm BeCu wire with dia. 460um -> 18nH, 0.01 Ohm

The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab, so I have had to play with the tuning and parameters to recover a suitable bake profile. This bake is pictured below (please excuse the default excel formatting).

I have increased the ramp time, temperature offset, and thermal mass within the oven; after retuning and applying the parameters indicated, the rate of heating/cooling never exceeds .5°C/min.

The ABO is controlled by a different temperature readout from the data logger used to collect data; the ABO readout is a small bead in contact with the shelf, while the data logger is a lug sandwiched between two stainless steel masses upon the shelf. I take the data logger profile to be more physically similar to the heating experienced by an optic in a gluing fixture, so I feel happy about the results of the above bake.

I plan to add the data source file to this post at my earliest convenience.

Follow up on OMC elog 379

I was able to obtain the following (dark blue) bake profile, which I believe is adequate for our needs.

The primary change was a remounting of the thermocouple to sandwich it between two stainless steel masses. The thermocouple bead previously was 1) in air and 2) close to the oven skin.

Dmass borrowed the LB1005 servo amp from the OMC lab.
It happened this week although it seems still January in his head. Got it back on Mar 24th

The A2 and C2 mirrors have been sent to Josh Smith at Fullerton for the scatterometer measurement.

First Contact kit (incl. Peek Sheets)
Manasa borrowed the kit on Feb 7. Got it back to the lab.

http://nodus.ligo.caltech.edu:8080/Cryo_Lab/799

(KA: Returned upon H1OMC building)

I wondered why the black glass beam dumps looked not as shiny as before. It was in fact a layer of dusts (or contaminants) accumulated on the surface.
The top part of the internal surface of the black glass was touched by a piece of lens tissue with IPA. The outer surface was already cleaned. IPA did not work well i.e. Required multiple times of wiping. I tried FirstContact on one of the outer surface and it efficiently worked. So I think the internal surfaces need to be cleaned with FC.

This is not an OMC related and even not happening in the OMC lab (happening at the 40m), but I needed somewhere to elog...

E1400445 first look

LIGO DCC E1400445

Attachment 1: Record of the original state

Attachment 2: Found one of the SMA cable has no shield soldering

EGE&G 2mm photodiode angle response measured by Sam T1100564-v1

Linearity of the EOM driver was tested. This test has been done on Nov 10, 2015.

- Attachment 1: Output power vs requested power. The output start to deviate from the request above 22dBm request.

- Attachment 2: Ctrl and Bias voltages vs requested power. This bias was measured with the out-of-loop channel.
The variable attenuator has the voltage range of 0~15V for 50dB~2dB attenuation.

Therefore this means that:

- The power setting gives a voltage logarithmically increased as the requested power increases. And the two power detectors are watching similar voltages.

- And the servo is properly working. The control is with in the range.

- Even when the given RF power is low, the power detectors are reporting high value. Is there any mechanism to realize such a condition???

Qs' were estimated with a lorentzian function (eye fit)

Current LHO EOM (final version, modulation depth measurement 2018/4/5)
f0=9.1MHz, Q=18
f0=45.38MHz, Q=46
f0=118.05MHz, Q=30

Prev LHO EOM (RF transmission measurement 2018/4/13)
f0=9.14MHz, Q=53
f0=24.25MHz, Q=55
f0=45.565MHz, Q=62;

3IFO EOM (RF transmission measurement 2018/4/23)
f0=8.627MHz, Q=53
f0=24.075MHz, Q=60
f0=43.5MHz, Q=65

The circuit models for the 3IFO EOM (before mods) were made using LISO.
Then the modification plan was made to make it a new LLO EOM.

Impedance data, LISO model, Mathematica files are zipped and attached at the end.

https://awiki.ligo-wa.caltech.edu/wiki/EOM_Mount_Stability

Here is a summary of the events of the last week, as they relate to EP30-2.

1) I lost the EP30-2 syringes that had been ordered for the OMC, along with the rest of the kit.

• Corrective action: Found in the 40m Bake Lab garbing area.
• Preventative action: log material moves and locations in the OMC elog
• Preventative action: log EP30-2 moves and locations in PCS via location update [LINK]
• Preventative action: keep EP30-2 kit on home shelf in Modal Lab unless kit is in use

2) The EP30-2 syringes ordered for the OMC Unit 4 build from January had already expired, without me noticing.

• Corrective action: Requested LHO ship recently-purchased EP30-2 overnight
• Preventative action: log expiration dates in OMC elog
• Preventative action: begin purchasing program supported by logistics, where 1 syringe is maintained on hand and replaced as it expires

3) LHO shipped expired epoxy on Thursday. Package not opened until Monday.

• Corrective action: Requested LHO ship current EP30-2 overnight, this time with much greater scrutiny (including confirming label indicates not expired)
• Preventative action: Packages should be opened, inspected, and received in ICS or Techmart on day of receipt whenever possible.

4) Current, unopened syringe of EP30-2 has been received from LHO. Expiration date is 22 Jan 2020. Syringe storage has been improved. Kit has been docked at its home in Downs 303 (Modal Lab) (see attached photo, taken before receipt of new epoxy).

Current Status: Epoxy is ready for PZT + CM subassembly bonding on Monday afternoon 23 September.

EP30-2 bonding setup

EP30-2 gluing test

This post captures the curing timeline followed by OMC PZT Assys #9 and #10.

Source file posted in case any updates or edits need to be made.

The following is the current status of the epoxies used in assembly of the OMC (excerpt from C1900052)

Re-purchasing efforts are underway and/or complete

• DONE
  • Masterbond EP30-2 currently located in Downs 303, Modal Lab (see image)
    • ( WILL EXPIRE JANUARY 2020 )
    • ( tracked using THIS PCS LINK https://services.ligo-la.caltech.edu/Inventory/history.php?recid=1582&invtype=cit_noncap )
  • Electronic Materials Inc Optocast 3553-LV procured via PCard, will arrive today 22 October
    • plan to track using PCS is WIP
• WIP
  • Epoxy Pax EP-1730-1 quoted and requisitioned, PO is WIP

Firstly, the excess epoxy was removed using a cleaned razor balde

Secondly, EP30-2 epoxy was applied at the exterior edges of the beam dump.
Interior of the V were glued at two points. This is to keep the gap away from being trapped

Here is the result of the gluing. Some epoxy was sucked into the gap by capillary action.
I believe, most of the rigidity is proivded by the bonds at the edges.

A carpenter has come to install the eyeware storage and hooks for the face shields.