Measure the power ratio between the forward-propagating and reverse-propagating beams.

1. Place a small deflecting mirror at the transmission.
2. Place a flat mirror at the deflected transmission. When the alignment of this mirror is adjusted to retroreflect this beam, the DC of the cavity reflection PD increases, and also the CCD shows spurious fringes.
3. This condition allows us to locate the power meter at the reverse-propagating spot of the transmission (Attachment 1)
4. Place a black glass beam dump for the main (bright) transmission (Attachment 2)
5. Now the power meter is receiving the counter-propagating beam. Turn off the room light and place an anodized Al baffle as shown in Attachment 2. Move the baffle to block only the counter-propagating. Move the baffle out. => Record the power meter reading with/without the baffle in the counter-propagating path. The difference is the power of the reverse-propagating beam.
6. Now measure the power of the reflected main transmission. This tells us the power ratio between the foward- and back-propagating beams.
7. Remove the small deflecting mirror and measure the power of the main transmission.
8. Now the back-propagating power can be estimated from 6 and 7. The same amount is going back to the IFO path.
9. The reflectivity can be calculated from the 7 and the transmission

- To increase the incident laser power, NPRO Current ADJ was set to be 0 (increased from -50)

- 1st:  Without the baffle 0.373 +/- 0.001 uW / With the baffle 0.318 +/- 0.001 uW
- 2nd: Without the baffle 0.370 +/- 0.001 uW / With the baffle 0.318 +/- 0.001 uW
- 3rd: Without the baffle 0.370 +/- 0.001 uW / With the baffle 0.317 +/- 0.001 uW

==> 53.3 +/- 0.6 nW

- The main transmission was 84.0mW
==> Backpropagation ratio was 0.634+/-0.007 ppm

- Direct measurement of the OMC was  after BS 96.6mW
==> Backpropagation power from the cavity: 61.3 +/- 0.7 nW

- Cavity transmission for the matched beam is Tcav RinputBS = 0.963
==> Incident resonant TEM00 power 100.3mW

- Reflection 61.3+/-0.7 nW x RinputBS = 60.8+/-0.7 nW
-> The effective reflectivity for the mode-matched resonant TEM00 beam incident on the OMC (1st steering mirror) is 0.606+/-0.007 ppm

The profile of the beam incident on the fiber input

The fiber input was deflected by a 45deg mirror. The beam profile was measured with WincamD. The beam was too strong (~60mW) even at the smallest pump power (ADJ -50) of the NPRO. So the two ND20 filters were added to the lens right before the 45 deg mirror and the camera.

The measured profile had some deviation from the nice TEM00 particularly around the waist. This could be a problem of the too small beam on the ND filter and the CCD.
This is not an issue as we just want to know the approximate shape of the beam.

For the fiber coupling, if we have the beam waist radius of ~200um it is sufficient for decent coupling.

The backscatter beam is supposed to appear in the backpropagation path. The transmission of the OMC has a couple of optics, it's not easy to access that beam.
To try to deflect the beam either horizontally or vertically, small optical pieces were made. (Attachment)

These are the combination of the optics

- Thorlabs PF05-03 Fused Silica Mirror Blank (dia12.7mm x t 6.0mm) + Thorlabs 1/2"sq BB Dielectric Mirror BBSQ05-E03

- Thorlabs PF05-03 Fused Silica Mirror Blank (dia12.7mm x t 6.0mm) + Thorlabs ME05-G01 Protected Al Mirror (dia12.7mm x t 3.2mm) + Thorlabs MRA10-K13 Right-Angle Prism Nd:YAG 10mm

Torr seal was used as the bonding epoxy. It uses a 1:2 volume mixture (not easy because of the viscosity) and is relatively fast to cure (in a couple of hours).
The test piece showed some softness after 3~4 hours so I left the parts cured overnight at room temp (i.e. 18degC)

Bond reinforcement blocks for the invar brackets:

• Attachment 1: CLASS A glass prisms (the surplus of the 2016 repair)
• Attachment 2: Dirty reiforcement bars made of Aluminum
• There are also many dirty prisms in the kit obtained from Stephen

The Windows laptop for WincamD/Beam'R2 (DELL Vostro3300) was not functional.
- Windows 7 got stuck in the starting up process (Google "startup repair loop")
- The battery can't charge and the adapter connection is flaky

I decided to newly install Win10.
I made a new bootable Win10 DVD from the ISO downloaded from IMSS. The ISO file was converted to CDR using Disk Utility on Mac.
This deleted the past disk partitions. The installation process has no trouble and Win10 ran successfully. The machine is slow but still acceptable for our purpose.
Dataray Version 7.1H25Bk was downloaded from the vendor website https://dataray.com/blogs/software/downloads and installed successfully.
The devices ran as expected by connecting the heads and selecting the proper device in the software.

Then, the Win10 fell into "Hibernation Loop" and "Shutdown loop" (after disabling hibernation in the safe mode).
This is probably the combination of extremely slow windows update (feature update i.e. beta OS update) and the occasional shutdown due to the flakiness of the AC connection

Win10 was reinstalled and automatic Win update was disabled via windows policy manager or something like that. Still, it tries to download and update some of the updates (what's happening there!?

Here are my strong recommendations on how to use this laptop

• Do not use any network connection. It will enable Windows Update kicks in and destroy the machine.
• Use a USB stick for data transportation if necessary
• The laptop should always be connected to the power supply at a stable location. (The adapter connection is flaky and the battery is dead)
• Buy a replacement battery (maybe a 3rd-party cheap one
• The Win10 DVD should always be inserted into the laptop's drive so that we can reinstall the windows anytime.

o Power Budget after FirstContact cleaning (2022/07/20)
NPRO ADJ -50 (min)
Fiber incident --.-mW
Fiber output --.-mW
Matching to the fiber ??%

DCPD T =  8.62  +/- 0.01  mW
REFPD  =  3.549  +/- 0.001 V

DCPD R =  9.46  +/- 0.01  V
REFPD  =  3.562 +/- 0.001 V

CM1    =  74.5  +/- 0.1   uW
REFPD  =  3.585 +/- 0.001 V

CM2    =  81.7  +/- 0.1   uW
REFPD  =  3.585 +/- 0.001 V

REFLPD
vOFS    = -6.197 +/- 0.001 mV (beam blocked)
vOFS_REF= +4.58mV

LOCKED =  47.6  +/- 0.2   mV
REFPD  =  3.596 +/- 0.003 V

UNLOCK =  2.700 +/- 0.003 V
REFPD  =  3.590 +/- 0.001 V

P_Inc  =  19.36 +/- 0.001  mW
REFPD  =  3.594 +/- 0.001 V

Analysis Result

- Cavity coupling 0.980 (2.0% junk&sidebands)

- Cavity R&T: R=229ppm, T=0.970 (previous T=0.946, 2.4% UP!)
- OMC Throughput (Cavity T x First BS R): T=0.963
- Cavity loss per mirror 42.8 ppm / Round Trip Loss 238ppm

o Power Budget (2022/07/18)
NPRO ADJ -50 (min)
Fiber incident 62.8mW
Fiber output 45.1mW
Matching to the fiber 72%

DCPD T =  8.90  +/- 0.01  mW
REFPD  =  3.760  +/- 0.001 V

DCPD R =  8.82  +/- 0.01  V
REFPD  =  3.760 +/- 0.001 V

CM1    =  81.4  +/- 0.1   uW
REFPD  =  3.767 +/- 0.001 V

CM2    =  86.6  +/- 0.1   uW
REFPD  =  3.767 +/- 0.001 V

REFLPD
OFS    = -6.214 +/- 0.001 mV (beam blocked)
OFS_REF= +4.587mV

LOCKED =  57.5  +/- 0.5   mV
REFPD  =  3.970 +/- 0.003 V

UNLOCK =  2.816 +/- 0.003 V
REFPD  =  3.943 +/- 0.001 V

P_Inc  =  20.04 +/- 0.01  mW
REFPD  =  3.946 +/- 0.001 V
 

Analysis Result

- Cavity coupling 0.989 (1.1% junk&sidebands)

- Cavity R&T: R=756ppm, T=0.946
- OMC Throughput (Cavity T x First BS R): T=0.939
- Cavity loss per mirror 90 ppm / Round Trip Loss 432ppm

== Initial Preparation ==

• [Done] OMC #002 placement
• [Done] OMC #002 locking
• Details OMC ELOG 414

== Measurements ==

• [Done] Transmission / Power budget before FirstContact OMC ELOG 416
• [Done] Transmission / Power budget after FirstContact OMC ELOG 417
• [Done] Backscatter measurement with a new deflection optics
  • [Done] Optics bonding done waiting for cure OMC ELOG 420 -> Returned the bond to Madeline OMC ELOG 424
  • [Done] Backscatter measurement
    • Measurement: 0.6 ppm OMC ELOG 422
    • (Transmission is 10~60mW. If the backscatter is the order of 1ppm or less, we expect the light level is ~10nW. Can we really detect it? How? ... OK... last time the measurement has been done with the stick PD type powermeter with baffles and the room light turned off (OMC ELOG 209). So it's not totally crazy.)
• [Done] High QE PD preparation / install / QE check
  • [Done] High QE PD inventory check
    • A1-23    LLO OMC#001
    • A1-25    LLO OMC#001
    • B1-01    LHO OMC#003
    • B1-16    LHO OMC#003
    • B1-22    @CIT Cage B1 Cleaned/Installed
    • B1-23    @CIT Cage B2 Cleaned/Installed
    • C1-03    @CIT Cage B3 Cleaned
    • C1-05    Dead / CIT contamination test cav
    • C1-07    Dead / CIT contamination test cav
    • C1-08    @CIT Cage C2
    • C1-09    @CIT Cage C3
    • C1-10    @CIT Cage C4
    • C1-11    @CIT Cage D1
    • C1-12    @CIT Cage D2
    • C1-14    @CIT Cage D3
    • C1-15    Dead / CIT Cage D4
    • C1-17    LHO Spare
    • C1-21    LHO Spare
    • D1-08    not @CIT, maybe LLO Spare?
    • D1-10    not @CIT, maybe LLO Spare?
  • [Done] Install & QE check
    • 1st attempt OMC ELOG 427
    • 2nd attempt OMC ELOG 429
• [Done] Fiber input beam characterization OMC ELOG 421

== Repair / Preparation ==

• [Done] Obtain: UHV Foil (done) / EP30 (found at the 40m OMC ELOG 434) / EP30-2 bonding setup OMC ELOG 442
• [Done] Crimper tool? LLO bought a new one and modify it.
• [Done] BeCu wire clamps:
  • [Done] Sufficient # of clamps found:OMC ELOG 428 / C&Bed
• [Done] FirstContact cavity mirror cleaning (see OMC ELOG 414)
• [Done] FirstContact for protection OMC ELOG 430
   
• Beam dump cleaning -> not necessary
   
• [Done] Replacing the cable bracket
  • [Done] Obtain all parts from Stephen.
  • [Done] Class B Torque wrench present in the lab
  • [Done] Replacement work
    • Recorded the original connections and the cable routing OMC ELOG 431
    • Unmounting the cable bracket OMC ELOG 432
    • Spare situation check OMC ELOG 433
    • Cable bracket replacement OMC ELOG 436
    • New cable tie installed OMC ELOG 437
• [Done] Delamination Repair
  • Delamination status OMC ELOG 414
  • More delamination check OMC ELOG 426
  • Reinforcement parts Inventory OMC ELOG 419
  • Cleaning of the reinforcement bars / Asking Madeline for C&B OMC ELOG 424
  • Delamination of the black glass pieces observed -> reinforcement required OMC ELOG 431
  • Delamination repair part1 OMC ELOG 438  OMC ELOG 439 OMC ELOG 440
  • Delamination repair part2 OMC ELOG 441 OMC ELOG 443 OMC ELOG 444 
• [Done] Check all the fasteners / Ready for the shipment OMC ELOG 445
• Check addon mass configuration OMC ELOG 446  OMC ELOG 447

== Shipping ==

• [Done] Tools to ship to LLO OMC ELOG 448
  • CLASS B special tool kit (Allens / Pliers / Mighty-Mouse spanner / Spatula / etc)
  • FC kit
  • Electronic kit (PD connector / trans-impedance amp)
  • Spare High QE PDs
  • Power meters
  • Glass Beamdumps (for optical testing)
  • Cable bracket replacement kit (PEEK cable bracket / cable pegs / fastners / spare fasteners / kapton sheet / cable ties)
  • Emergency EP30-2 kit (excluding the bond)
     
• [Done] OMC Pelican Filling (Stephen) / OMC Outerbox/insulation (Stephen/Downs) / OMC Shipment Aug 29, 2022 OMC ELOG 445

- The lab is chilly (18degC)

- Cleaned the lab and the optical table a bit so that the delicate work can be done. The diode test rig (borrowed from Downs - see OMC ELOG 408 and OMC ELOG 409) was removed from the table and brought to the office (to return on Monday)

- The rack electronics were energized.

- The OMC mirrors in use were returned to the cases and stored in the plastic box.

- The optical table was also cleaned. Removed the old Al foils. The table was wiped with IPA

- The OMC #4 was moved to the other part of the table, and then OMC #2 was placed in the nominal place (Attachment 1). Note that the "legs" were migrated from #4 to #2. There are three poles that defines the location of the OMC Transportation

- The lid was removed and the OMC was inspected (Attachment 2). Immediately found some more delamination of the epoxy beneath the cable bracket (Attachment 3). This needs to be taken care of before shipment.

- The cavity was already flashing as usual, and a bit of alignment made the TEM00 flashing.

- The locking was a little tricky because the LB unit seemed to have a gain-dependent offset. After some adjustment, robust locks were achieved. The cavity was then finely adjusted. Attachment 4 shows the CCD image of the reflection. The core of the spot is more or less axisymmetric as usual. There is also a large helo around the spot. I was not aware of this before. I may need to wipe some of the mirrors of the input path.

- As the satisfactory lock was achieved, I called a day by taking a picture of the table (Attachment 5).

The table width was an inch too large compared to the door width. We need to tilt the table and it seemed too much for us. Let's ask the transportation for handling.

Photo courtesy by Juan

I've cleared the small optical table and wondered how to move it out of the room. Fortunately, the north side of the big table had wide enough clearance and let the 36" wide table go through. This was easy without moving other heavy stuff.

From here to the door, a bit of work is required. A possibility is to roll the laser blocking wall to the south side of the big table. This will require moving the shelving in the entrance area but it's not a lot of work compared to disassembling a part of the wall.

If this does not work somehow, we will consider removing the last panel of the wall and it will definitely allow the table to get out from the door.

More explicit insights into the inventory for the Unit 4 build. Image of inventory included below.

Machined Parts:

• New fabrication = Contents of Storage-11112 are consistent with upgrade ECR.
• Old leftovers = Storage-9482 and Storage-9483 .

Cable Components:

• Hughes Circuits made us Kapton flex circuits. These have not been processed in any way.
• Rich had supplied a spool of Gore 4-conductor in-vacuum wire (see below image). I returned the sppol for Rich but it is living in Downs and available for use.
• PEEK cable ties were damaged during bake, and will be replaced by SYS inventory.

Retrofit/Repair Capabilities:

• Aluminum reinforcement brackets D1600316
• Glass reinforcement brackets (Edmund Optics 45-072 and 45-071)

ref: E1900034 and other associated documents.

Measurement result:

The capacitance at no bias was 460~500pF. This goes down to below 300pF at 1.0~1.5V reverse bias. At maximum +15V, the capacitance goes down to 200~220pF.

On this opportunity, the capacitances of a couple of Excelitas C30665 photodiodes were measured. In Attachment 2, the result was compared with one of the results from the high QE PDs. In general the capacitance of C30665 is lower than the one from the high QE PDs.

Attachment 1: System diagram. The reverse bias voltage is controlled by DS335. This can produce a voltage offset up to 10V. A G=+2 opamp circuit was inserted so that a bias of up to +15V can be produced. The capacitances of the photodiodes were measured with SR720 LCR meter with a probe. DS335 and SR720 were controlled from PC/Mac via serial connections.

Attachment 2: Overview

Attachment 3: How was the probe attached to the photodiode under the test

Attachment 4: The bias circuitry and the power supply

Attachment 5: G=+2 amp

Item loan: SRS LCR meter SRS720 borrowed from Downs. The unit is at the 40m right now for testing with an excelitas PD. Once it is done, the setup will be moved to the OMC lab for testing the high QE PDs

OMC Unit 4 Build Machined Parts are currently located in Stephen's office. See image of large blue box from office, below.

Loaned item D1100855-V1-00-OMC08Q004 to Don Griffith for work in semi-clean HDS assy.

This includes mass mounting brackets, cable brackets, balance masses, etc. For full inventory, refer to ICS load Bake-9527 (mixed polymers) and Bake-9495 (mixed metals).

Inventory includes all items except cables. Plasma sprayed components with slight chipping were deemed acceptable for Unit 4 use. Cable components (including flex circuit) are ready to advance to fabrication, with a bit more planning and ID of appropriate wiring.

The amplifier BW was 400kHz at the gain of 1e7 V/A. And the max BW is 500kHz even at a lower gain. I have to setup something special to see the RF band dark noise.
With this situation, I stated "the RF dark noise should be characterized by the actual WFS head circuit." in the 40m ELOG.

I see that these measurements are done out to 100 kHz - I guess there is no reason to suspect anything at 55 MHz which is where this QPD will be reading out photocurrent given the low frequency behavior looks fine? The broad feature at ~80 kHz is the usual SR785 feature I guess, IIRC it's got to do with the display scanning rate.

The dark noise levels of the four Q3000 QPDs were measured with FEMTO DLPCA200 low noise transimpedance amp.

The measurement has been done in the audio frequency band. The amp gain was 10^7 V/A. The reverse bias was set to be 5V and the DC output of the amplifier was ~40mV which corresponds to the dark current of 4nA. It is consistent with the dark current measurement.

The measured floor level of the dark current was below the shot noise level for the DC current of 0.1mA (i.e. 6pA/rtHz).
No anomalous behavior was found with the QPDs.

Note that there is a difference in the level of the power line noise between the QPDs. The large part of the line noises was due to the noise coupling from a soldering iron right next to the measurement setup, although the switch of the iron was off. I've noticed this noise during the measurement sets for QPD #83. Then the iron was disconnected from the AC tap.
 

To know any anomaly to the junction capacitance of the QPD segments, the RF impedances were tested with a hand-made impedance measurement.
All segments look almost identical in terms of capacitance.

Measurement setup:
The impedance of a device can be measured, for example, from the complex reflection coefficient (S11). To measure the reflection, a bidirectional coupler was brought from the 40m. Attachments 1 and 2 shows the connection. The quantity A/R shows S11. The network analyzer can convert a raw transfer function to an impedance in Ohm.

Calibration and Measurement limit:
The network analyzer was calibrated with 1) a piece of wire to short the clips 2) 50ohm resistor 3) open clips. Then the setup was tested with these three conditions (again). Attachment 3 shows the result. Because of the impedance variation of the system (mainly from the Pomona clip, I guess), there looks the systematic measurement error of ~1pF or ~25nH. Above 100MHz, the effect of the stray impedance is large such that the measurement is not reliable.

The setup was tested with a 10pF ceramic capacitor and this indicated it is accurate at this level. The setup is sufficient for measuring the diode junction capacitance of 300~500pF.

Impedance of the QPD segments:

Then the impedances of the QPD segments were measured (Attachment 4). The segments showed the identical capacitance of 300~400pF level, except for the variation of the stray inductance at high freq, which we can ignore. Note that there is no bias voltage applied and the nominal capacitance in the datasheet is 225pF at 5V reverse bias. So I can conclude that the QPDs are quite nominal in terms of the junction capacitance.

(Ed: 11/23/2020 The RF components were returned to the 40m)

Dark current measurement for InGaAs QPDs (OSI FCI-InGaAs-Q3000) has been done using Keithley 2450 and Frank's diode test kit. Frank's setup uses various custom instruments which are no longer exist, therefore the kit was used only for switching between the segments.

The diodes were serialized as 81, 82, 83, 84, continuing the numbering for the OMC QPDs. The numbers are engraved at the side and the back of the diode cans.

Overall, the QPDs nominally indicated the usual dark current level of <10nA.
SEG1 of #82 showed a lower voltage of reverse breakdown but this is not a critical level.
#83 showed variations between the segments compared to the uniform characteristics of #81 and #84.

FEMTO DLPCA200 low noise preamp (brand new)

Keithley Source Meter 2450 (brand new) => Returned 11/23/2020

were brought to the OMC lab for temporary use.

https://nodus.ligo.caltech.edu:8081/QIL/2522

I helped to complete the 5th OMC Transport Fixture. It was built at the 40m clean room and brought to the OMC lab. The fixture hardware (~screws) were also brought there.

Thorlabs' powermeter controler + S401C head was lent from OMC Lab. Returned to OMC Jul 15, 2022 KA

https://nodus.ligo.caltech.edu:8081/SUS_Lab/1856

See this entry: https://nodus.ligo.caltech.edu:8081/40m/15642

The image flipping of the display unit was fixed. The vendor told me how to fix it.

- Open the chassis by the four screws at the side.
- Look at the pass-through PCB board between the mother and display boards.
- Disconnect the flat flex cables from the pass-through PCB (both sides) and reconnect them (i.e. reseat the cables)

That's it and it actually fixed the image flipping issue.

To spare some room on the optical table, I wanted to mount the two TFT monitor units on the HEPA enclosure frame.
I found some Bosch Rexroth parts (# 3842539840) in the lab, so the bracket was taken for the mount. This swivel head works very well. It's rigid and still the angle is adjustable.

https://www.boschrexroth.com/ics/cat/?cat=Assembly-Technology-Catalog&p=p834858

BTW, this TFT display (Triplett HDCM2) is also very nice. It has HDMI/VGA/Video/BNC inputs (wow perfect) and the LCD is Full-HD LED TFT.
https://www.triplett.com/products/cctv-security-camera-test-monitor-hd-1080p-led-display-hdcm2

https://www.newegg.com/p/0AF-0035-00016

https://www.bhphotovideo.com/c/product/1350407-REG/triplett_hdcm2_ultra_compact_7_hd_monitor.html

The only issue is that one unit (I have two) shows the image horizontally flipped. I believe that I used the unit with out this problem before, I'm asking the company how to fix this.

The output of Mephisto 800NE (former TNI laser) was measured.
The output power was measured with Thorlabs sensors (S401C and S144C). The reference output record on the chassis says the output was 837mW at 2.1A injection.
They all showed some discrepancy. Thus we say that the max output of this laser is 1.03W at 2.1A injection based on the largest number I saw.

According to the past backscatter test of the OMC (and the black glass beamdump: not V type but triangular type on a hexagonal-mount), the upper limit of the back reflection was 0.13ppm. https://nodus.ligo.caltech.edu:8081/OMC_Lab/209

I don't have a BRDF measurement. We can send a few black glass pieces to Josh.

are there any measurements of the BRDF of these things? I'm curious how much light is backscattered into the incoming beam and how much goes out into the world.

Maybe we can take some camera images of the cleaned ones or send 1-2 samples to Josh. No urgency, just curiosity.

I saw that ANU and also some labs in India use this kind of blue/green glass for beam dumps. I don't know much about it, but I am curious about its micro-roughness and how it compares to our usual black glass. For the BRDF, I think the roughnesss matters more for the blackness than the absorption.

Check-in to the OMC lab to see the status. Nothing seemed changed. No bug. The HEPA is running normal. The particle level was 0.

Went into the HEPA enclosure and put a cover on the OMC. Because of the gluing template, the lid could not be close completely (that's expected and fine).

The IPA vector cloth bag was not dry yet but seemed expired (some smell). There is no stock left -> 5 bags to be ordered.

Black and Decker Glue Baking Oven came back to the OMC lab on Aug 10, 2020, Georgia had lent the unit for the SAMS assembly/testing.

The particle counter came back to the OMC lab on Aug 10, 2020

Item lending as per Ian's request: Particle Counter from OMC Lab to QIL

The beamdumps were taken out from the oven and packed in bags.

The bottom of the V are completely "wet" for 17 BDs among 20 (Attachment 1/2).

3 BDs showed insufficient glue or delamination although there is no sign of lack of rigidity. They were separated from the others in the pack.

[Koji, Jordan, Stephen]

The beam dumps, bonded on Fri 06 Dec 2019, were placed in the newly tuned and configured small dirty ABO at the Bake Lab on Fri 13 Dec 2019.

Images are shared and references are linked below

Bonding log entry - https://nodus.ligo.caltech.edu:8081/OMC_Lab/386

Bake ticket - https://services.ligo-wa.caltech.edu/clean_and_bake/request/992/

OMC Beam Dump - https://dcc.ligo.org/LIGO-D1201285

[Stephen, Koji]

20 glass beamdumps were bonded at the 40m cleanroom.

Attachment 1: We had 20 fused silica disks with a V-groove and 40 black glass pieces
Attachment 2: The black glass pieces had (usual) foggy features. It is well known to be very stubborn. We had to use IPA/acetone and wiping with pressure. Most of the feature was removed, but we could still see some. We decided to use the better side for the inner V surfaces.
Attachment 3: EP30-2 expiration date was 1/22/2020 👍. 7.66g of EP30-2 was poured and 0.38g of glass sphere was added. Total glue weight was 8.04g
Attachment 4: Glue test piece was baked at 200F in a toaster oven for ~12min. It had no stickiness. It was totally crisp. 👍👍👍
Attachment 5: Painted glue on the V-groove and put the glass pieces in. Then gave a dub of blue at the top and bottom of the V from the outside. In the end, we mostly had the glue went through the V part due to capillary action.
Attachment 6: The 20 BDs were stored in stainless vats. We looked at them for a while to confirm there is no drift and opening of the V part. Because the air bake oven was not available at the time, we decided to leave the assys there for the room temp curing, and then later bake them for the completion of the curing.
 

From Cryo Cav setup

Borrowed LB1005 Servo box -> OMC

The following is the current status of the epoxies used in assembly of the OMC (excerpt from C1900052)

Re-purchasing efforts are underway and/or complete

• DONE
  • Masterbond EP30-2 currently located in Downs 303, Modal Lab (see image)
    • ( WILL EXPIRE JANUARY 2020 )
    • ( tracked using THIS PCS LINK https://services.ligo-la.caltech.edu/Inventory/history.php?recid=1582&invtype=cit_noncap )
  • Electronic Materials Inc Optocast 3553-LV procured via PCard, will arrive today 22 October
    • plan to track using PCS is WIP
• WIP
  • Epoxy Pax EP-1730-1 quoted and requisitioned, PO is WIP

This post captures the curing timeline followed by OMC PZT Assys #9 and #10.

Source file posted in case any updates or edits need to be made.

OMC PZT Assy Production Cure Bake (ref. OMC elog 381) for PZT Assy #9 and #10 started 27 September 2019 and completed 28 September 2019. Captured in the below figure (purple trace). Raw data has been posted as an attachment as well.

We have monitored the temperature in two ways:

1) Datalogger thermocouple data (purple trace).
2) Checking in on temperature of datalogger thermocouple (lavender circles) and drive thermocouple (lavender diamonds), only during initial ramp up.

Comments on bake:

• No changes were made to the tuning or instrumentation of the oven between the successful qualifying bake obtained on 26 September (ref. OMC elog 380). However, the profile seems to have been more similar to prior qualifying bake attempts that were less successful (ref. OMC elog 379), particularly as the oven seems to have ramped to an overtemperature state. I am a bit mystified, and I would like to see the oven tuning characterized to a greater extent than I have had time and bandwith to complete within this effort.
• The maximum datalogger temperature was 104 °C, and the duration of the soak (94 °C or higher) was 68 minutes. This was in contrast to a programmed soak of 2.5 hours and a programmed setpoint of 84 °C.
• The drive thermocouple did appear to be under-reporting temperature relative to the datalogger thermocouple, but this was not confirmed during the soak period. Neither thermocouple was calibrated as part of this effort.

Friday: [Stephen, Koji]

As the oven setting has qualified, we brought the PZT assys in the air bake oven.

Monday: [Stephen, Shruti, Koji]

We brought the PZT assys to the clean room. There was not bonding between the flexture and the PZT subassy (Good!). Also the bonding o at each side looks completely wetted and looks good. The package was brought to the OMC lab to be tested in the optical setup.

Follow up on OMC elog 379

I was able to obtain the following (dark blue) bake profile, which I believe is adequate for our needs.

The primary change was a remounting of the thermocouple to sandwich it between two stainless steel masses. The thermocouple bead previously was 1) in air and 2) close to the oven skin.

The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab (sound familiar? OMC elog 377), so I have had to play with the tuning and parameters to recover. This bake seemed to inadequately match the intended temperature profile for some reason (intended profile is shown by plotting prior qualifying bake for comparison).

The parameters utilized here are exactly matching the prior qualifying bake, except that the autotuning may have settled on different parameters.

Options to proceed, as I see them, are as follows:

1. reposition the oven's driving thermocouple closer to the load and attempt to qualify the oven again overnight
2. retune the controller and attempt to qualify the oven again overnight
3. proceed with current bake profile, except monitor the soak temperature via data logger thermocouple and intervene if temperature is too high by manually changing the setpoint.

[Stephen, Shruti, Koji]

We worked on the gluing of the PZT sub-assy (#9 and #10) along with the designed arrangement by Shruti (OMC ELOG 374).

The detailed procedures are described in E1300201 Section 6.2 PZT subassembly and Section 7.3 EP30-2 gluing.

We found that the PZTs, which were debonded from the previous PZT sub assy with acetone, has some copper wires oxidized. However, we confirmed that this does not affect the conductivity of the wires, as expected.

The glue test piece cooked in the toaster oven showed excellent curing. GO SIGNAL

Stephen painted the PZT as shown in Attachment 1.

The fixtures were closed with the retaining plate and confirmed that the optics are not moving in the fixtures.

At this point, we checked the situation of the air-bake oven. And we realized that the oven controller was moved to another vacuum oven and in use with a different setting.

Stephen is going to retrieve the controller to the air bake oven and test the temp profile overnight. Once we confirm the setting is correct, the PZT sub assys will be heat cured in the oven.  Hopefully, this will happen tomorrow. Until then, the sub-assys are resting on the south flow bench in the cleanroom.

The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab, so I have had to play with the tuning and parameters to recover a suitable bake profile. This bake is pictured below (please excuse the default excel formatting).

I have increased the ramp time, temperature offset, and thermal mass within the oven; after retuning and applying the parameters indicated, the rate of heating/cooling never exceeds .5°C/min.

The ABO is controlled by a different temperature readout from the data logger used to collect data; the ABO readout is a small bead in contact with the shelf, while the data logger is a lug sandwiched between two stainless steel masses upon the shelf. I take the data logger profile to be more physically similar to the heating experienced by an optic in a gluing fixture, so I feel happy about the results of the above bake.

I plan to add the data source file to this post at my earliest convenience.

The following items are presently staged at the 40m Bake Lab (see photo indicating current location) (noting items broght by Koji as well):

1. Bonding fixtures, now modified with larger washers to constrain springs, and with modification from OMC elog 358.
2. Curved Mirrors and Tombstones as selected by Shruti in OMC elog 374.
3. PZTs as debonded from first iteration subassemblies (SN 12 and SN 13)
4. Epoxy-cure-testing toaster oven
5. Other items I can't think of but will populate later  =D

The following item is in its home in Downs 303 (Modal Lab)

1. EP30-2 epoxy (expiration 2020 Jan 22) with full kit (tracked in PCS via location update [LINK])

Here is a summary of the events of the last week, as they relate to EP30-2.

1) I lost the EP30-2 syringes that had been ordered for the OMC, along with the rest of the kit.

• Corrective action: Found in the 40m Bake Lab garbing area.
• Preventative action: log material moves and locations in the OMC elog
• Preventative action: log EP30-2 moves and locations in PCS via location update [LINK]
• Preventative action: keep EP30-2 kit on home shelf in Modal Lab unless kit is in use

2) The EP30-2 syringes ordered for the OMC Unit 4 build from January had already expired, without me noticing.

• Corrective action: Requested LHO ship recently-purchased EP30-2 overnight
• Preventative action: log expiration dates in OMC elog
• Preventative action: begin purchasing program supported by logistics, where 1 syringe is maintained on hand and replaced as it expires

3) LHO shipped expired epoxy on Thursday. Package not opened until Monday.

• Corrective action: Requested LHO ship current EP30-2 overnight, this time with much greater scrutiny (including confirming label indicates not expired)
• Preventative action: Packages should be opened, inspected, and received in ICS or Techmart on day of receipt whenever possible.

4) Current, unopened syringe of EP30-2 has been received from LHO. Expiration date is 22 Jan 2020. Syringe storage has been improved. Kit has been docked at its home in Downs 303 (Modal Lab) (see attached photo, taken before receipt of new epoxy).

Current Status: Epoxy is ready for PZT + CM subassembly bonding on Monday afternoon 23 September.

Aim: To find the combinations of mounting prism+PZT+curved mirror to build two PZT sub-assemblies that best minimises the total vertical beam deviation.

(In short, attachment 1 shows the two chosen sets of components and the configuration according which they must be bonded to minimize the total vertical angular deviation.)

The specfic components and configuration were chosen as follows, closely following Section 2.3.3 of T1500060:

Available components:

Mounting prisms: 1,2,12,14,15 (Even though there is mention of M17 in the attachments, it can not be used because it was chipped earlier.)

PZTs: 12,13

Curved mirrors: 10,13

Method:

For a given choice of prism, PZT and mirror, the PZT can be placed either at 0deg or 180deg, and the mirror can rotated. This allows us to choose an optimal mirror rotation and PZT orientation which minimises the vertical deviation.

Total vertical angle 

 was measured by Koji as described in elog 369.

,              are the wedge angle and orientation respectively and were measured earlier and shown in elog 373 . 

,               The measurement of the location of the curvature bottom (d, ) of the mirrors is shown in elog 372 . The optimal  is to be found.

These steps were followed:

1. For every combination of prism, PZT, and mirror, the total vertical deviation was minimized with respect to the angle of rotation of the curved mirror computationally (SciPy.optimize.minimize). The results of this computation can be found in Attachment 2: where Tables 1.1 and 2.1 show the minimum achievable deviations for mirrors C10 and C13 respectively, and Tables 1.2 and 2.2 show the corresponding angle of rotation of the mirrors  .
2. From the combinations that show low total deviations (highlighted in red in Attachment 2), the tolerances for 5 arcsec and 10 arcsec deviations with mirror rotation were calculated, and is shown in Tables 1.3, 1.4, 2.3, 2.4 of Attachment 2.
3. While calculating the tolerances, the dependence of the vertical deviations with rotation were also plotted (refer Attachment 3).
4. Two sets from available components with low total deviation and high tolerance were chosen. 

Result:

These are the ones that were chosen:

1. M14 + PZT13 at 0deg + C13 rotated by 169deg anticlockwise (tot vertical dev ~ -3 arcsec)
2. M12 + PZT12 at 0deg + C10 rotated by 88deg clockwise (tot vertical dev ~0 arcsec)

The method of attaching them is depicted in Attachment 1.

Using the measurements of PZTs 12,13 taken by Stephen, I estimated the wedging angle and orientation following Section 2.3.1 of T1500060. The results can be found in Attachment1 and is summarised as follows.

For PZT 12, PZT 13 respectively:

Avg. height = 2.0063 mm, 2.0035 mm

Wedge direction (from the same direction as in the doc: positive right) = 120 deg, 120 deg

Wedge angles = 45.8 arcsec, 30.6 arcsec

This was done assuming that the measurements were taken uniformly at intervals of 60deg along the inner rim of the PZT. The diameter (2r) of the inner rim, according to T1500060, is 9mm. The measured heights were fitted with the function

as depicted in Attachment2 to find wedging angle and orientation .