The OMC #002 is ready for shipment.
Attachment 1: Work done on Sept 19, 2022
Other attachments: Putting the OMC in the pelican case.
Inspected the past LLO add-on mass configuration.
There are unknown masses at the DCPD side. It looks like a small SS mass with an estimated mass of 5g. But the DCC number is unknown.
We are going to add 10g on each corner as well as the damping aterial. We should be able to figure out the fastener / mass configuration.
Here is the balance mass info for the LLO OMC#001 analyzed from the photographs
If we attach the additional mass, longer 1/4-20 screws (1", 1" 1/8, 1" 1/4) are going to be used.
Started July 15, 2022 and finished Aug 30. So it took ~1.5 months (with a couple weeks of break)
Class B special tools
First Contact Kit
Bonding kit (excl EP30-2 bond)
Power meters (excl Power meter controller)
Cable bracket replacement kit
Optics / Optomechanics
=== Action done on Aug 30 ===
Fiber MM setup / Fiber coupler mount
Glass Beamdumps (for optical testing)
Thorlabs fiber coupler tool
General bent nose plier for fiber
Thorlabs collimator tiny allen
Spare High QE PDs
Spare OMC bags / Zip bags
Balance Mass 10g Qty 8 (Different Type D11*** 1.25" dia), 20g Qty 10 / Mass damper D1700301 -04 / Mass damper screws SHCS 1/4-20 x 1.25 Qty 25 / 1" screws and 1 1/8" screws
Shipping request: https://services1.ligo-la.caltech.edu/FRS/show_bug.cgi?id=25002
=== Low supply! ===
Upon the LLO work, the current PD arrangement in the cages are:
B1 OMC1 PDT (A1-23)
B2 OMC1 PDR (A1-25)
B3 original (C1-03)
B4 OMC2 PDT (B1-22)
C1 OMC2 PDR (B1-23)
C2 original (C1-08)
C3 original (C1-09)
C4 original (C1-10)
Fiber matching: 43.2/56.7 = 76%
S/P-pol ratio 0.7/43.2 = 1.6%
Clean Supply Ordered
The measured total optical loss of the OMC was
1st: 0.015 +/- 0.003
2nd: 0.085 +/- 0.005
3rd: 0.0585+/- 0.0008
4th: 0.047 +/- 0.002
In avegrage the estimated loss is
Loss = 0.055 +/- 0.014
This is unchanged from the measurement at LLO after the FC cleaning
Loss = 0.053 +/- 0.010
The damaged black glass was removed from the OMC breadboard leaving the glass base.
The black glass pieces were bonded very tightly on the FS base with EP30-2. The apparent amount of the bond was not so much but it was such hard that removal by hand was not possible.
We decided to give drips of Acetone on the base hoping the gradual dissolving of EP30-2. Using a knife edge, the "filets" of the bonds were removed, but the BD was still tight.
By wedging the black glass-black glass bonding with the nife edge, the left side (the directly damaged one) was taken off from the structure leaving a tiny fragment of the glass on the base.
The remaining one was even stronger. We patiently kept dripping Acetone on the base and finally, the black glass piece was knocked off and removed from the base.
Attachment 1: The base right after the black glass removal.
Attachment 2: The black glass pieces were stored in a container with Al foil + clean cloth bed. The damaged and fogged surfaces faced up.
Attachment 3: The zoom-in shot of the black glass pieces.
Attachment 4: The base was wiped with Acetone and cleaned with FC. We will bond another BD assembly on the base, presumably using the UV epoxy.
Photo of the BS1 AR cleaning process
Attachment 1: Before cleaning. Foggy surface is visible.
Attachment 2: After FC cleaning. The structure of the deposited material is still quite visible.
Attachment 3: Acetone scrubbing. Cotton Q-tip was used so that the stick does not melt with acetone.
Attachment 4: After acetone scrubbing. Nicely clean!
Acetone scrubbing was applied to HR/AR of BS1, FM1, FM2, BS2, and HR of CM1 and CM2. (total 10 surfaces)
Then final FC paint was applied to these 10 surfaces.
We'll come back to the setup on Thu for FC peeling and loss measurement.
- Removed the first contact we left on Monday.
- Measured transmission (Set1) Very high loss! Total optical loss of 18.5%! Observation with the IR viewer indicated that CM1 has bright scattering. We suspencted a remnant of FC.
- Applied the second FC on the four cavity mirrors. This made the CM1 sport darker.
- Measured the transmission (Set1~Set3). We had consistent loss of 4.2~5.0%. We concluded that this is the limitation of this OMC even with the cleaning.
Conclusion on the cleaning of OMC #001
- After a couple of first contact cleaning trials and deep cleaning, the total loss was measured to be 0.045+/-0.004.
This indicated a slight improvement from the loss measured at LLO before any cleaning (0.064+/-0.004).
However, the number did not improve to the level we marked in 2013 (0.028+/-0.004).
- This loss level of 4.5% is comparable to the loss level of OMC #3, which is currently used at LHO.
Therefore, this OMC #1 is still a useful spare for the site use.
- Some notes / to-do regarding this unit:
1) The beam dump with melted black glass was removed. A new beam dump needs to be bonded on the base.
2) The connector bracket still needs to be replaced with the PEEK version.
3) The PZT of CM1 has been defunct since 2013. Combining LV and HV drivers is necessary upon use at the site. (LLO used to do it).
OMC Transmission measurement after the 2nd deep cleaning
The 2nd deep cleaning didn't improve the transmission. (See Attachment 2)
The measured loss was 0.044+/-0.002
Aaron took the set to Cryo lab
We obtained Regent grade DI water. It was poured into a smaller cup.
FC liquid was also poured into a small beaker.
Wash the mirror with a swab. We should have used a smaller swab that GariLynn has in her lab.
As soon as the mirror was wiped with the water, the FC was applied with a large brush. Don't let the water away!
Then more layer of the FC was added as usual.
The quick painting of FC made a mess around the mirrors due to excess liquid (Attachment 2). So, we decided to remove the FC remnants (on non-optic surfaces) with cotton swabs and then applied FC as usual.
This made the mess removed, however, we found the OMC loss was increased to >10%(!) (Attachment 3). We decided to continue tomorrow (Thu) with more weapons loaded consulting with GariLynn.
Another set of FC cleaning was applied to FM1/FM2/CM1/CM2 and SM2. Some FC strings are visible on SM2. So I decided to clean SM2 as well as the cavity mirrors close to SM2 (i.e. FM2 and CM2)
As a result, the bright scattering spot on CM1 is now very dim. And the loss was reduced to 4.0%. This is 0.4% better than the value before the water cleaning.
It'd be interesting to repeat the water cleaning, at least on FM1. FM1 is the closest cavity mirror to the beam dump damaged by the high-power laser pulse.
Maybe we should also clean the AR side of FM1 and BS1, as they were right next to the damaged beam dump. It is not for the loss but for reducing the scattering.
The second trial of the water scrub
A bright scatter is visible on FM1, so I tried water scrub on FM1. This time, both surfaces of FM1 and both surfaces of BS1 were cleaned.
Smaller Vectra swabs were used for the scrub. Then the water was purged by IPA splashed from a syringe. Right after that FC was applied.
This was a bit messy process as the mixture of water/IPA/FC was splattered on the breadboard.
Nevertheless, all the mess was cleaned by FC in the end.
The transmission measurements are shown in Attachment 1, and the analyzed result is shown together with the past results.
The 2nd water scrub didn't improve the transmission and it is equivalent to the one after the two times of deep cleaning.
I concluded that the water scrub didn't change the transmission much (or at all). We reached the cleaning limit.
We started buikding the OMC #4.
We quickly measured the basic parameters of the OMC as is.
=== FSR ===
Used the technique to find a dip in the transmission transfer function (TF) with offset locking + phase modulation. The FSR was 264.79003MHz = The cavity length of 1.13219 [m] (requirement 1.132+/-0.005 [m])
=== TMS ===
Used the technique to find the peaks in the trans TF with phase modulation + input misalignment + trans PD clipping.
TMS_V: 58.0727 / TMS_H: 58.3070 => TMS/FSR V:0.219316 H:0.220201
This makes the 9th-order modes nicely avoided (Attachment 1). A slightly longer FSR may makes the numbers close to the nominal.
=== Spot positions ===
The image/video capture board turned out not functional with the new Apple silicon mac. We decided to use a small CCD monitor and took a photo of the display.
All the spots are within the acceptable range. The scattering on CM2 was particularly bright on the CCD image and also in the image with the IR viewr.
The spot on FM1/2 are right at the expected location. The spot on CM1 is 0.5mm low and 0.7mm inside (left). The spot on CM2 is ~0.25mm too high and 0.3mm outside.
(Attachment 2, a small grid is 1 mm/div)
== Transmission ==
We made a quick simplified measurement (Attachment 3).
Assuming the reflectivity of the matched beam to be ~0, the mode matching is M=1-(59.2e-3-(-6.5e-3))/(3.074-(-6.5e-3))=0.979
==> The power of the coupled mode is M x 21.28mW = 20.83 mW
The measued transmission was 19.88 mW
==> The OMC transmission (total) was 0.954 (4.5% loss)
This number is not too bad. But the spot on CM2 has too bright scattering. Next week, we want to check if swapping CM2 may improve the situation or not.
We replaced CM2 with a PZT mirror subassembly serialized by PZT "13" (Attachment 1).
This made the transmission increase to 96.x%. Therefore the quick measurement of FSR and TSM were done. Also more careful measurement of the transmission was done.
== Alignment ==
== Quick measurement of the transmission ==
Transmission: 20.30 mW
Reflection Voltage (locked): 65.0 mV
Reflection Voltage (unlocked): 3.094 V
Reflection Voltage (dark): -6.5 mV
Incident Power: 21.64 mW
---> Mode matching 1-0.023 / Pcoupled = 21.14 / OMC Transmission 0.96
96% transmission is not the best but OK level. We decided to proceed with this mirror combination.
== Quick measurement of FSR/TMS ==
TMS_V = 58.2105MHz
TMS_H = 58.1080MHz
The HOM structure (with PZT Vs = 0) is shown in Attachment 3. 9th order modes look just fine. The excplicit coincidence is 19th order 45MHz lower sideband. (Looks good)
== Transmission measurement ==
The raw measurements are shown in Attachment 4. The processed result is shown in Attachment 5.
We found that data set 2 has exceptionally low transmission. So we decided to run the 4th measurement excluding the set 2.
Over all OMC loss
Set1: 0.029 +/- 0.014
Set3: 0.041 +/- 0.0014
Set4: 0.038 +/- 0.001
--> 0.036 +/- 0.004
[Camille, Koji] Log of the work on Dec 15, 2023
The vertical and horizontal TMSs for OMC #4 were measured with the PZT voltages scanned from 0V to 200V.
We concluded that this alignment nicely avoids the higher-order mode structure up to ~19th order. We are ready for the cavity mirror bonding.
The RF transfer functions to the trans RF PD from the modulation on the BB EOM were taken with the presence of the vertical misalignment of the incident beam and the vertical clipping of the beam on the RFPD.
The typical measurement results and the fitting results are shown in Attachments 1/2.
The TFs were taken with the voltage 0, 50, 100, 150, and 200V applied to PZT1 while PZT2 were left open. The measurement was repeated with the role of PZT1 and PZT2 swapped.
The ratio between the TMS and FSR was evaluated for each PZT voltage setting. (Attachment 3)
When the PZTs are open, the first coincident resonance is the 19th-order mode of the 45MHz lower sideband. (Attachment 4)
When the PZT2 voltage is scanned with PZT1 kept at ~0V, no low-order sidebands come into the resonance (Attachment 5) until the PZT1 voltage is above 100V.
We found that the high voltage on PZT1 misaligns the cavity in yaw and the spot (presumably) moves to an undesirable area regarding the cavity loss.
This does not happen to PZT2. Therefore the recommendation here is that the PZT2 is used as the high voltage PTZ, while PZT1 is for the low voltage actuation.
We worked on the bonding of the flat mirrors for the OMC cavity with UV epoxy.
- Prepared the UV illumination setup. Cleaned up the table a bit to spare some space for the illuminator.
- Checked the output power of the illuminator. The foot pedal worked fine. The timer was set to be 10s. The UV output from the fiber was nominally 6W. This is after some warming up for ~1min. (Checked the output power continuously with the UV power meter.)
- Checked the cavity alignment / FSR / TMS - it looked good at this moment
- We confirmed that the UV epoxy has an expiration of July 3, 2023. The bond capsule was brought from Downs right before the work started, and thawed at the lab.
- The bottom of FM1 and the breadboard were cleaned. Cleaning with lens cleaning paper + IPA remained a few specks of dust on the surface. We decided to use Vectra swabs to wipe the breadboard surface. This worked pretty well.
- Applied a tap of UV epoxy to FM1 and placed it on the template. The optic was constrained by a retainer clip.
- We found that the spot positions were significantly moved. Probably FM1 was not well touching the template before. We tried to recover the previous optical axis by aligning CM1 and CM2.
- Here is the tip: align the beam on CM1 at the desired spot. Move CM1 to bring the spot on CM2 to the desired spot. CM2 is aligned to have TEM00 as much as possible.
- We recovered reasonable spots on the mirrors. Measured the FSR and TMS (vertical and horizontal) to be 264.73MHz, 58.18MHz, and 58.37MHz, respectively. This makes the 9th-order modes well separated from TEM00. Very good.
- Gave UV illumination 10s x 2. Confirmed that the mirror is rigidly bonded.
- Continued to bond the other flat mirror. The same process was repeated.
- The bottom of FM2 and the breadboard were cleaned.
- Applied a tap of UV epoxy to FM2 and placed it on the template. The optic was constrained by a retainer clip.
- Measured the FSR and TMS (vertical and horizontal) to be 264.7925MHz, 58.15MHz, and 58.3725MHz, respectively. This makes the 9th-order modes well separated from TEM00. Very good.
- Continued to bond some less important mirrors.
- SM1 was placed on the template with the same step as above. BS2 (for QPD) and a dummy QPD housing were also placed just to check if the optical axis has any inconsistency. The good beam alignment on the QPD housing was confirmed.
- Applied a bond to SM1 and blasted the UV (20s)
- Applied a bond to BS2. Checked the alignment on QPD1 again. It looked good. UV illumination was applied.
- Placed BS3 to the cavity transmission. A dummy DCPD housing was placed at the reflection side of BS3. There was no inconsistency with the beam alignment.
- The UV illumination was applied (20s).
CM1: PZT ASSY #8 (M7+PZT11+C11)
CM2: PZT ASSY #11 (M14+PZT13+C13)
We continued to bond two CM mirrors and the other two steering mirrors for QPD2.
Before the bonding work, the FSR and TMSs were checked again.
FSR: 264.7925 MHz
TMS_V: 58.15125 MHz
TMS_H: 58.33375 MHz
Checked the transmission: The OMC loss was 4.3 +/- 0.2 %.
This does not make the HOMs coincidently resonant until the 18th-order (+9MHz). Looks good.
- Applied the bond to CM1 and the UV illuminated.
- Applied the bond to CM2 and the UV illuminated.
==> The cavity bonding is completed.
Removed the micrometer for CM2 to allow us to bond SM2/SM3
- Checked the spot at QPD2: The spot was a couple of mm too left. This was too much off compared to the QPD adjustment range. ==> Decided to shim the SM3 position with a piece of Al foil.
- Otherwise everything looked good. SM2/SM3 were bonded.
Invar block bonding
- There are three tubes of EP30-2 that expires on 2/22, 2023.
- A tube was almost empty. Used this tube to fill/purge the applicator. The 2nd tube was then attached to squeeze out 8g of glue mixture.
- 0.4g of fused silica beads were added to the glue mixture.
- Mixed the bond and a test piece was baked by the oven. (200F=95C, 5min preheat, bakeing 15min).
- The glue test piece was "dry" and crisp. Looked good.
- Applied the glue on the invar blocks. Confirmed that the bonding surfaces were made completely "wet".
- 4-40 screws were inserted to the blocks so that the blocks were pushed toward the template. See Attachments 3 and 4.
CM1: PZT ASSY #8 (M7+PZT11+C11)
CM2: PZT ASSY #11 (M14+PZT13+C13)
Qty1 1/2 mounts
Qty2 prism mounts
Qty6 gluing fixures
Qty1 Rotary stage
Qty1 2" AL mirror
Qty1 Base for the AL mirror
=> Handed to Stephen -> Camille on Jan 27, 2023.
The bottom side template was separated into two pieces and successfully removed from the breadboard. The template was assembled together again and bagged to store it in a cabinet.
We found that the invar block for DCPD(R) was bonded with some air gap (Attachment2 1/2).
The Allen key used as a weight was too small, which caused it to get under one of the screws used as hooks and lift the block.
We've investigated the impact of this tilt.
- Bonding strength: The bonding area is ~60% of the nominal. So this is weak, but we can reinforce the bonding with an aluminum bar.
- Misalignment of the DCPD housing: The tilt will laterally move the position of the DCPD. However, the displacement is small and it can be absorbed by the adjustment range of the DCPD housing.
- Removal: From the experience with the removal of the beam dump glass, this requires a long time of acetone soaking.
- We don't need to remove the invar block.
- Action Item: Reinforcement of the bonding
During the second UV epoxy session, we did not bond the input beam dump. This is because this beam dump was not the one planned from the beginning and if it was bonded in place, it would have created difficulties when removing the template.
First, we aligned a couple of Allen wrenches to define the location of the beam dump. We've checked that the main transmission is not blocked at all while the stray beam from the OMC reflection is properly dumped.
After the confirmation, the UV epoxy + UV alight were applied.
The resulting position of the beam dump is shown in the attachment.
1. Flipping the OMC
It turned out that the transport fixture for this OMC could not be closed. The locks are too short, and the knobs could not be turned. We temporarily fastened the long 1/4-20 screws to secure the box and flipped it to make the top side face up.
2. Setting up the top-side template
The top side template was attached to the breadboard. We took care that the lock nuts on the positioning screws were not touched. The margins between the template and the glass edges were checked with a caliper. The long sides seemed very much parallel and symmetric, while the short sides were not symmetric. The lock nut on the short side was loosened, and the template was shifted to be symmetric w.r.t. the breadboard.
3. UV epoxy work
The cylindrical glass pieces were wiped, and the bonding surfaces were cleaned so that the visible fringes were <5 fringes. We confirmed the hooking side is properly facing up. The UV epoxy and UV curing were applied without any trouble. (Attachment 1)
4. EP30-2 bonding of the invar mounting blocks
Six invar blocks were bonded. This time the Allen key weights were properly arranged, so they didn't raise the blocks. The bond properly wetted the mating surfaces.
The final step of the bonding is to remove the template.
And replace the locks of the transport fixture.
A beam dump was stacked on the base of the previous beam dump. The angle was determined so that the main transmission goes through while the stray OMC reflection is blocked without clipping at the edge.
The resulting alignment of the beam dump is shown in Attachment 1.
The beam dump tended to slip on the base. To prevent that a couple of weights were placed around the bonding area. (Attachment 2)
The AL metal bracket was replaced with a PEEK version.
Attachments 1/2: Before the replacement. The photos show how the cables are arranged.
Attachment 3: How the replacement work is going. The 1/4-20 screws were super tight. Once the connectors were removed, an Allen key was inserted to a hole so that the 1/4-20 on the short sides were removed by closing Allen key arms. For the screws on the longer sides, the same technique can be applied by using three Allen keys. This time none of the screws/cable pegs were wasted. The clothes were used to protect the breadboard from any impact of the action.
Attachments 4/5: Final state.
OMC #1 repair has been 100% done
We still have 4 correct cable pegs and many 1/4-20 BHSCs for OMC #4.
Yesterday, we noticed that we could not close the transport fixture for OMC #4. We could not fully rotate the knobs of the locks. Today, I took the hooks from the functioning locks of the spare transport fixture.
It turned out that the default dimension of the lock seemed too tight. The functioning one has the through holes elongated by a file or something. This modification will be necessary for future transport fixtures.
Today we tested the functionality of the four remaining PZTs (11,12,13 and 22) . Each PZT was placed within a collimated 500um beam.
Roughly half of the beam was blocked by the PZT. The PZT and a PD then acted as shadow sensor. Each PZT was tested with 0 and
150 V. The resulting power change then could be converted into a displacement of the PZT using the beam diameter.
The open light value for each of these tests was 3.25 V.
0 V supply voltage --> 1.717 V on PD
150 V supply voltage --> 1.709 V on PD
delta = 0.008 V
0 V supply voltage --> 1.716 V on PD
150 V supply voltage --> 1.709 V on PD
delta = 0.007 V
0 V supply voltage --> 1.702 V on PD
150 V supply voltage --> 1.694 V on PD
delta = 0.008 V
0 V supply voltage --> 1.770 V on PD
150 V supply voltage --> 1.762 V on PD
delta = 0.008 V
0.008 V --> 0.24% change in power on PD --> about 3.8 um displacement assuming no light which is blocked
by the PZT is hitting the PD.
We further started to drive all four PZTs over night with 100 V (half of their range) at 100 Hz.
We additionally display the impedance to ensure none of them degrades.
All four PZTs seem to be connected to Teflon coated wires. It needs to be checked if these
fulfill the vacuum compatibility requirements.
[Joe, Koji, Liyuan, Philip, Stephen]
Work done on 16.04.2019
Finishing assembly of transport box
Assembly worked fine except for the clamping structure to clamp the lid of the transport box to the bottom part.
It seemed that some of the plastic of these clamps became brittle during the baking. The plastic was removed and the
clamps where wiped clean. It appears that the clamps can't be locked as they should. Still the transport box should be fine
as the long screws will mainly clamp the two parts together.
Preparing the transport box to mount the breadboard
The lid of the the transport box was placed upside down and clamped to the table. All peak clamping structures where pulled back as far as possible.
Preparation and cleaning of the breadboard
We unpacked the breadboard and found lots of dust particles on it (most likely from the soft paper cover which was used). We used the ionized nitrogen gun
at 25 psi to get rid of the majority of particles and cross-checked with a bright green flash light before and after blowing. The second stage of cleaning was done
below the clean room tent and included the wiping of all surfaces. The breadboard was then placed into the prepared lid of the transport box and clamped with peak
Unpacking of the template
The previously cleaned template was unpacked while the last layer of coverage was removed below the cleanroom tent.
Template adjustment on the breadboard
All peak screws of the clamping structure of the template where removed. The template was placed onto the breadboard only seperated by peak spacers.
All peak screws have been inserted for horizontal clapming. A calipper was used to measure the distance of each edge of the template to the edge of the
breadboard. For documentation the labeled side of the bradboard (facing away from the persons on the pictures) of the upside down breadboard is defined to
be the south side, continuing clockwise with west, north and east. First rough alignment was done by shifting the template on the breadboard and then the
peak screws where used for fine tuning. The caliper values measured where:
North C 8.32mm E 8.52 mm W 8.41 mm
East C 8.08 mm
South C 8.32 mm
West C 8.02 mm
(E indicating east side position, W indicating west side position and C indicating center position)
ach[Joe, Phillip, Koji, Stephen]
Work from 17.04.2019
First contact cleaning of OMC optics
We cleaned the OMC optic with first contact. After a first cleaning run all mirrors except for two looked
fine. One had some first contact residuals on the left at center height and another had some particle sitting
near the center area. As the ionized nitrogen gun didn't help we applied another round of first contact which resolved
the two issues. Unfortutanely the second run of cleaning again left some residuals of first contact at the edges.
We were able to peal these off with tweezers.
Placement of Optics at the breadboard
We cleaned the contact surfaces for the bonds using optic wipes and pure isopropanol. The placement wen't well for 3 of the 5 optics (low number of newtonian rings).
One was recleaned and placed on the breadboard again which seemed fine. For the 5th no newtonian rings could be seen (either verry ood or bad) we planed on trying it in the current set-up. Mirrors used can be seen in attachment 3.
We took apart the unit removed from the 3rd IFO (Unit serial number aLIGO #3, XTAL 10252004) to see what makes it tick. Koji has done a fine job of adding the plots of the impedance data to this log book. Attached are some details of the physical construction showing the capacitor values used in shunt before the coils.
Attached please see my notes summarizing the models for the electrodes and inductors within the 3rd IFO EOM
Attached is a block diagram of the test setup used in the 40m lab to measure the modulation index of the IO modulator
Norna Robertson, Stephen Appert || 29 Nov 2017, 2 pm to 4 pm || 227 Downs, CIT
We made some preparations for modal testing, but did not have enough time to make measurements. Below is an after-the-fact log, including some observations and photos of the current state of the OMC bench.
Preparation for the PZT subassembly bonding (Section 6.2 and 7.3 of T1500060 (aLIGO OMC optical testing procedure)
- Gluing FIxture (Qty4)
- Silica Sphere Powder
- Electric scale
- Toaster Oven for epoxy mixture qualification
- M prisms
- C prisms
- Noliac PZTs
- Cleaning tools (forceps, tweezers)
- Bonding kits (copper wires, steering sticks)
- Thorlabs BA-2 bases Qty2
- Razor Blades
Also brought to the 40m on 10 April, in preparation for PZT subassembly bonding:
- new EP30-2 epoxy (purchased Jan 2019, expiring Jul 2019 - as documented on documents attached to glue, also documented at C1900052.
- EP30-2 tool kit (maintained by Calum, consisting of mixing nozzles, various spatulas, etc)
Already at the 40m for use within PZT subassembly bonding:
- "dirty" ABO A with temperature controller (for controlled ramping of curing bake)
- clean work areas on laminar flow benches
- Class B tools, packaging supplies, IPA "red wipes", etc.
Upon reviewing EP30-2 procedure T1300322 (current revision v6) and OMC assembly procedure E1300201 (current revision v1) it appears that we have gathered everything required.
[Stephen, Philip, Koji, Joe]
Breadboard D1200105 SN06 was selected as described in eLOG 338. This log describes unwrapping and preparation of the breadboard.
Relevant procedure section: E1300201 section 6.1.5
Breadboard was unwrapped. No issues observed during unwrapping.
Visual inspection showed no issues observed in breadboard - no large scratches, no cracks, no chipping, polished area (1 cm margin) looks good.
Initially the breadboard has a large amount of dust and fiber from the paper wrapping. Images were gathered using a green flashlight at grazing incidence (technique typical of optic inspection).
PROCEDURE IMPROVEMENT: Flashlight inspection and Top Gun use should be described (materials, steps) in E1300201.
Top gun was used (with medium flow rate) to remove large particulate. Breadboard was placed on Ameristat sheet during this operation.
Next, a clean surface within the cleanroom was protected with Vectra Alpha 10 wipes. The breadboard, with reduced particulate after Top Gun, was then placed inside the cleanroom on top of these wipes. Wiping with IPA Pre-wetted Vectra Alpha 10 wipes proceeded until the particulate levels were acceptable.
Joe and Koji then proceeded with placing the breadboard into the transport fixture.
As mentioned in eLOG 331, either increased thermal cycling or apparent improvements in cured EP30-2 strength led to fracture of curved mirrors at unintended locations of bonding to the PEEK fixture parts.
The issue and intended resolution is summarized in the attached images (2 different visualizations of the same item).
Redline has been posted to D1600336-v3.
Drawing update will be processed shortly, and parts will be modified to D1600336-v4.
Summary: Beginning on 20 May 2019, two CM PZT assemblies were soaked in Acetone in an effort to debond the EP30-2 bonds between tombstone-PZT and between PZT-optic. Debonding was straightforward after 8 days of soaking. 24 hours of additional acetone soaking will now be conducted in an attempt to remove remnant EP30-2 from bonding surfaces.
Procedure: The assemblies were allowed to soak in acetone for 8 days, with acetone level below the HR surface of the optic. No agitation of the solution, mechanical abrasion of the bond, or other disturbance was needed for the bond to soften.
GariLynn contributed the glassware and fume hood, and advised on the process (similar to debonding of CM and PZT from OMC SN002 after damaging event). The equipment list was (WIP, more detail / part numbers will be gathered today and tomorrow):
Results: Today, 28 May 2019, I went to the lab to check on the optics after 8 days of soaking. Liyuan had monitored the acetone level during the first 4 days, topping up once on 24 May. All bonds were fully submerged for 8 days.
There were 2 assemblies soaked in one crystallizing dish. Debonded assemblies - ref OMC eLOG 328 for specified orientations and components:
PZT Assy #9 - ref. OMC eLOG 334 - M17+PZT#12+C10
PZT Assy #7 - ref. OMC eLOG 332 - M1+PZT#13+C13
PZT Assy #7 was investigated first.
A video of removal of C10 and PZT#12 from PZT Assy #9 was collected (See Attachment 8), showing the ease with which the debonded components could be separated.
Photos and video have been be added to supplement this report (edit 2019/07/08).
Wedge and thickness measurements of PZTs 12 and 13 took place after debonding and cleaning - results are shown in the first image (handwritten post-it format).
These thickness measurements seem to have come back thinner than previous measurements. It is possible that I have removed some PZT material while mechanically removing glue. It is also possible that there is systematic error between the two sets of measurements. I did not run any calculations of wedge ange or orientation on these data.
Note that cleaning of debonded PZTs involved mechanically separating glue from the planar faces of PZTs. The second image shows the razer blade used to scrape the glue away.
There were thick rings of glue where there had been excess squeezed out of the bond region, and there was also a difficult-to-remove bond layer that was thinner. I observed the presence of the thin layer by its reflectivity. The thick glue came off in patches, while the thin glue came off with a bit of a powdery appearance. It was hard to be certain that all of the thin bond layer came off, but I made many passes on each of the faces of the 2 PZTs that had been in the bonded CM assemblies. I found it was easiest to remove the glue in the bonded
I was anticipating that the expected 75-90 micron bond layer would affect the micrometer thickness measurements if it was still present, but I did not notice any irregularities (and certainly not at the 10 micron level), indicating that the glue was removed successfully (at least to the ~1 micron level).
Yesterday I measured the thickness of the PZTs in order to get an idea how much the PZTs are wedged.
For each PZT, the thickness at six points along the ring was measured with a micrometer gauge.
The orientation of the PZT was recognized by the wire direction and a black marking to indicate the polarity.
A least square fitting of these six points determines the most likely PZT plane.
Note that the measured numbers are assumed to be the thickness at the inner rim of the ring
as the micrometer can only measure the maximum thickness of a region and the inner rim has the largest effect on the wedge angle.
The inner diameter of the ring is 9mm.
The measurements show all PZTs have thickness variation of 3um maximum.
The estimated wedge angles are distributed from 8 to 26 arcsec. The directions of the wedges seem to be random
(i.e. not associated with the wires)
As wedging of 30 arcsec causes at most ~0.3mm spot shift of the cavity (easy to remember),
the wedging of the PZTs is not critical by itself. Also, this number can be reduced by choosing the PZT orientations
based on the estimated wedge directions --- as long as we can believe the measurements.
Next step is to locate the minima of each curved mirror. Do you have any idea how to measure them?
Here is a summary of the events of the last week, as they relate to EP30-2.
1) I lost the EP30-2 syringes that had been ordered for the OMC, along with the rest of the kit.
2) The EP30-2 syringes ordered for the OMC Unit 4 build from January had already expired, without me noticing.
3) LHO shipped expired epoxy on Thursday. Package not opened until Monday.
4) Current, unopened syringe of EP30-2 has been received from LHO. Expiration date is 22 Jan 2020. Syringe storage has been improved. Kit has been docked at its home in Downs 303 (Modal Lab) (see attached photo, taken before receipt of new epoxy).
Current Status: Epoxy is ready for PZT + CM subassembly bonding on Monday afternoon 23 September.
The following items are presently staged at the 40m Bake Lab (see photo indicating current location) (noting items broght by Koji as well):
The following item is in its home in Downs 303 (Modal Lab)
The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab, so I have had to play with the tuning and parameters to recover a suitable bake profile. This bake is pictured below (please excuse the default excel formatting).
I have increased the ramp time, temperature offset, and thermal mass within the oven; after retuning and applying the parameters indicated, the rate of heating/cooling never exceeds .5°C/min.
The ABO is controlled by a different temperature readout from the data logger used to collect data; the ABO readout is a small bead in contact with the shelf, while the data logger is a lug sandwiched between two stainless steel masses upon the shelf. I take the data logger profile to be more physically similar to the heating experienced by an optic in a gluing fixture, so I feel happy about the results of the above bake.
I plan to add the data source file to this post at my earliest convenience.
The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab (sound familiar? OMC elog 377), so I have had to play with the tuning and parameters to recover. This bake seemed to inadequately match the intended temperature profile for some reason (intended profile is shown by plotting prior qualifying bake for comparison).
The parameters utilized here are exactly matching the prior qualifying bake, except that the autotuning may have settled on different parameters.
Options to proceed, as I see them, are as follows:
Follow up on OMC elog 379
I was able to obtain the following (dark blue) bake profile, which I believe is adequate for our needs.
The primary change was a remounting of the thermocouple to sandwich it between two stainless steel masses. The thermocouple bead previously was 1) in air and 2) close to the oven skin.