Does this work? Is this insane?
Today we looked at possible locations for where we will be setting up Mariner Suspension and Cryo chamber. The first option was the far left table in the CAML lab but it seems that there is going to be an issue with height clearance, so we have come up with another solution which takes a table from Koji's lab which is 3'x4' ft and moving it into CAML lab in the back right of the lab. To move the table we may need to call facilities to help us because we will most likely need to take the table apart to get it out of the lab. The aisle space in Koji's lab is about 43 inches, but the doorway, which is the tightest space, is 35 inches.
After we have set up the table in CAML we are planning on moving the Chamber in DOPO-lab to CAML. We plan to use skyhook with has a load limit of 500lbs/227kg this should be more than enough to move the chamber. We still need to get the wheeled base for skyhook we are in the works in doing so.
Also, We want to remove the previous setup from the chamber and leave it at DOPO-lab. Stephen is going to figure out how to keep it clean (sort of). Besides these transportation logistics, I am also working on the electronics as an immediate task and the electrical arrangement in the chamber.
to do list
- Check the table height
- Check the chamber height (base/cap)
- Check how much the chamber cap needs to be lifted (so that we can remove it)
- Is the weight capacity sufficient?
- B246/QIL Skyhook
- OMC Lab
Table moving effort in the OMC lab: See https://nodus.ligo.caltech.edu:8081/OMC_Lab/412
I've managed to cut and crimp wires for the power board for coil driver. I will begin adding components to the coil driver board.
- Add Components to Coil Driver board
- Replace some Sat Amp Componetns
- Still working on moving optical table to CAML
- Unsure if cryochamber has been cleaned and moved
I've completed one coil driver board.
Hopefully next week I can finish the other 2 boards and make the modifications to the sat amp baords.
Update of my current work I have finished one coil driver board and started on the last two that I need here is the progress and Ideally, I'll finish by tomorrow.
Almost done with coil driver boards
For our optical contacting, Jennifer and I are starting out with glass (microscope slides), with the setup in the EE shop next to the drill press (photos from Jennifer to follow).
Some interesting links:
All three coil driver boards are complete and have been tested. Modification for all 4 sat amp have been completed. Ideally, I would like to finish all the chassis on Monday I have one just about done.
This was performed last Friday (7/8).
I secured a thermocouple perpendicular against the hotplate and recorded the maximum temperature the hotplate reached at Low, Medium, and High. It took about 5 minutes to reach a stable temperature, where stable means that the temperature stayed within +/- 0.5°C for a minute. The hotplate maintains a certain temperature by turning itself on and off, so the temperature would drop slightly (at most, a few °C) while the hotplate was off. The maximums were:
At the max temperature, I moved the perpendicular thermocouple around to roughly find the variation in tempearture at different locations on the hotplate. Facing the nob, the top right quadrant is about 10-20°C cooler than the other quadrants, which are within 5°C of eachother. Excluding the cooler quandrant, the center and the outer edge are within 5°C of eachother. The temperature increases as one approaches half the radius, with it being about 20-40°C greater than the center and outer edge. The highest recorded temparture was 289°C at half the radius in the bottom left quandrant. This was only meant to be a rough test to see how even the heating is.
Note that the slides have "GLOBE" printed on one side. I always bond the opposite using the opposite side without the text.
On Monday (7/11), I began experimenting with bonding, starting with "air-bonding," which is trying to make dry, gently cleaned slides stick. I achieved my first succesful optical contact with what I call "acidental water-assisted direct bonding" or "water-bonding," where I accidentally clasped two wet slides together while washing my dirty finger prints off them. After the accidental discovery, I repeated it by running water over the slides while there were clasped together and achieved the same result. After a few hours, I attempted partially sliding apart the second water-bonded sample. I could slowly push them apart by pressing my thumbs against the long edge, but it took quite a bit of force. I decided to let 4 samples sit overnight: 1 air-bonded, 1 air-bonded with the brass hunk on top of it, and 2 water-bonded. Neither time nor pressure improved the air-bonded samples as they still slid apart very easily. The first water-bonded sample slid apart easier, but one part remained stubornly attached until I began shaking it violently. The second water-bonded sample was much harder to slide apart than the last time I tested it. With all the force of my fingers, I could barely make it budge.
Finished all 3 Coil Drover chassis and power lines still need to install the rear cables will do that after I finish Sat Amp chassis tomorrow.
I have finished all coil driver and sat amp chassis they all seem to be functioning properly.
Note that I am just testing out different techniques, so I have not set up the thermocouples to precisely measure the temperatue.
On Tuesday, I developed a new method of putting water, isopropanol, or methanol on one slide then squishing the other slide on top of it to fill the gap with the afformentioned liquid. The slides are slippery at first, but as they dried, which took about 15 minutes, the bond forms. The bonds were strong enough that I could just barely push the slides appart by applying pressure to the side using my thumbs. I prepared 4 samples this way, 2 with iso and 2 with meth. I took one of each and heated them on Medium for 30 minutes under the brass hunk with the aluminum square on the bottom and copper foil on both sides of the samples. Earlier in the day, I tried heating them without the weight on top, but the heat just broke the bond. I took the remain two and set them aside as controls.
On Thursday, I returned to check the bonds. The heated samples had broken. I intented to check on Wednesday, but I was sick from food poisoning, so I do not know whether the bonds broke immediately after heating or due to sitting for an extra day. For the control samples, one also had a broken bond, but the other had become even stronger.
I noticed that, when the slides are successfully bonded, the shape and appearance of the Newton's rings change, which can be seen in the pictures. I speculate that the circles on the unbroken control are the bonded regions. Ideally, we want to see no Newton's rings.
I've been running the HR coating optimization for mariner TMs. Relative to the specifications found here we now are aiming for
Both the PSL and AUX cavity finesses range the few couple of thousands, and the goal is not to optimize the coating stack for noise, but more importantly for the transmission values and tolerances. This way we ensure the average finesse and differential finesse requirements are met. Anyways, Attachment #1-2 shows the transmission plots for the optimized coating stacks (so far). Attachments #3-4 show the dielectric stacks. The code still lives in this repository.
I'm on the process of assessing the tolerance of this design stacks against perturbations in the layer thicknesses; to be posted in a follow-up elog.
Here are some corner plots to analyze the sensitivity of the designs in the previous elog to a 1% gaussian distributed perturbation using MCMC.
Attachment #1 shows the ETM corner plot
Attachment #2 shows the ITM corner plot.
I let the indices of both high and low index materials vary, as well as the physical thicknesses and project their covariances to the transmission for PSL and AUX wavelengths.
The result shows that for our designs it is better to undershoot in the optimization stage rather than meet the exact number. Nevertheless, 1% level perturbations in the optical thickness of the stack result in 30% deviations in our target transmission specifications. It would be nice to have a better constraint on how much each parameter is actually varying by, e.g. I don't believe we can't fix the index of refraction to better than 1%., but exactly what its value is I don't know, and what are the layer deposition tolerances? These numbers will make our perturbation analysis more precise.
Just a general update of what I have been up to deriving Lagrange for double pendulum system and also been looking at code that koji gave to me I've add comment to some of the code also working on my report.
we have 23 OSEMS they look all full built and I will try and test them this week and or next week.
I have found that, after cleaning the glass with methanol (or even sometimes with just a dry lense-cleaning cloth), I can get glass slides to bond by rappidly rubbing them together until something sticks. This was inspired by watching "Wizard of Vaz" perform bonds on YoutTube. While cleaning, I now use enough strength to make the glass squeak, as advised by him.
Upon heating, I encountered the same issue as when I bonded them by putting a liquid (water, methanol, etc.) in the gap, which leads me to now believe that the broken bond is not due to the expansion of a liquid. Further, even at the low temperature of 60°C, placing the liquid-less sample on the hotplate breaks the bond in seconds, which I caught on video. In the attached video*, you can see that, before the heat, the bond is strong enough that I cannot push it appart with my fingers, but after the heat, it slides easily. Note that, outside of taking the video, I always lay the entire slide on the center of the metal so the sample is evenly heated.
*This is my first time attaching a video. If it didn't attach properly, I'll add it on to a later log. I also want to record myself performing the rubbing bonding technique.
Sat amp seems to be working just fine. There does seem to be a saturation issue with one of the outputs we may need to change a resistor on the board.
Yesterday, I did two rounds of slowly heating 4 samples to the maximum hot plate temperature. This was to formally test if my success with a single sample earlier in the week was a fluke. Note that the hot plate takes about 10-15 minutes to reach a stable temperature when it is turned up one notch.
I bonded 4 samples by putting methanol in the gap between the glass slides and letting it dry to create a gap.
Starting at room temperature, I heated the slides on each setting for roughly 15 minutes, then let them cool down naturally over the course of an hour. 3 broke broke at medium heat, and 1 survived the whole process. I belive these broke because the bonds were weaker and I heated them slightly too quickly. In previous tests, I would manually switch the hot plate on and off, but I wanted to see if the hot plate could heat up slow enough on its own.
I bonded 4 samples by scrubbing the slides with methanol, using a compressed air duster to blow off the fibers, rubbing them together with the pressure of my fingers, and repeating this whole procedure until they stuck (it took 2-4 repeats).
Starting at room temperature, I heated the slides on each setting for exactly 20 minutes, then let them cool down naturally over the course of an hour. All of them survived to the maximum temperature (the pictures show them at the start and end of the heating, note the temperature). I credit this to the stronger bonding proceedure and the extra 5 minutes for them to adjust to the temperature. I did not turn the hot plate on or off at any point, I just let it heat up at its own rate.
I cannot tell if the bonds are stronger. The size and shape of the Newtons rings did not change.
In the following test, a single Sat Amp chassis that holds Sat Amp Board S1106078 and S1106077
Verification of Sat Amp
First, as the test of the LED driver circuits in the chassis, 8 of various color LEDs were inserted to the appropriate output pins of the chassis. This resulted in all the LED lit and the LED mon TP was confirmed to have voltage outputs of 5V. (See my previous ELOG)
Connected OSEMs to the sat amp to test the OSEM LED/PD pairs. With the first test, the PD out gave us 15V. We wondered if this was just the problem of the OSEM or circuit, or just there are too much light for the transimpedance gain of 121K Ohm.
By blocking the OSEM light by a random heat shrink tube found on the table, we saw the number got reduced. This indicates that the OSEM/Satamp outputs are working and there are just too much light.
We decided to reduce the gain: The transimpedance gain R18 was reduced to 16k, which gave us a voltage range from 5V~7V with some outlier OSEMS at 1V (See the attached table)
There are 24 total OSEMs:
(These numbers given after the change of R18 to 16k Ohm)
Note: We originally aimed for 8~9V. However, from a previous study of OSEM at cryogenic temperature, we learned that there was about an about 30% increase in the response.
Therefore, we decided to leave a sufficient margin from 10V considering this expected increase in the response.