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6   Wed Mar 17 19:51:42 2021 PacoGeneralDesign specsSilicon TM dichroic coatings for phase I

### Update on ETM

New optima are being found using the same basic code with some modifications, which I summarize below;

1. Updated wavelengths to be 2128.2 nm and 1418.8 nm (PSL and AUX resp.)
2. The thickness sensitivity cost "sensL" previously defined only for 2128 nm, is now incorporating AUX (1418 nm) in quadrature; so sensL = sqrt(sens(2128) ** 2 + sens(1418)**2)
3. There is now a "starfish" plot displaying the optimized vector cost. Basically, the scores are computed as the inverse of the weighted final scalar costs, meaning the better stats reach farther out in the chart. One of these scalar costs does not actually belong to the optimization (stdevL) and is just a coarse measure of the variance of the thicknesses in the stack relative to the average thickness.
4. Included a third wavelength as transOPLV (for the OPLEV laser) which tries to get R ~ 99 % at 632 nm
1. Imagine,... a third wavelength! Now the plots for the transmissivity curves go way into the visible region. Just for fun, I'm also showing the value at 1550 nm in case anyone's interested in that.
5. Adapted the MCMC modules (doMC, and cornerPlot) to check the covariance between the transmissivities at 2128 and 1418 for a given design.
6. Reintroduced significant weights for TO noise and Brownian noise cost functions (from 1e-11 to 1e-1) because it apparently forces solutions with lower thickness variance over the stack (not definitive, need to sample more)

Still working to translate all these changes to ITM, but here are samples for some optimum.

• Attachment 1 shows the spectral reflectivity/transmissivity curves with a bunch of labels and the transparent inset showing the starfish plot. Kind of crazy still.
• Attachment 2 shows the stack. Surprisingly not as crazy (or maybe I have internalized the old "crazy" as "normal")
• Attachment 3 shows a very simple corner plot illustrating the covariance between the two main wavelengths transmissions.
5   Fri Mar 5 11:05:13 2021 StephenGeneralDesign specsFeasibility of 6" optic size in CAD

6" vs 4" optic size comparison using CAD - worth hopping into the 3D geometry using the link below, but also posting a couple of images below.

1) We can adjust all parameters relating to the suspension frame except the beam height. Is there enough clearance under the optic for the internal shield?

--> Using the representation of the MOS structure as-is, there is about 1" of clearance between the bottom panel of the first/internal shield under the 6" case, compared with 2" of clearance in the 4" case. This is not very scary, and suggests that we could use a 6" optic size.

2) Any other concerns at this point?

--> Not really, there are degrees of freedom to absorb other issues that arise from the simple 4" --> 6" parameter shift

EASM posted at https://caltech.app.box.com/folder/132918404089

4   Thu Mar 4 17:04:52 2021 PacoGeneralDesign specsSilicon TM dichroic coatings for phase I

Have been using the 40m Coatings repo code by Gautam (with some modifications to make dichroic designs under Ta2O5_Voyager), as well as the parameters compiled in the Mariner wiki for Silica-tantala thin films. Here are some of the top picks.

## ETM

For ETM, the target transmissivities are 5.0 ppm @ 2128.2 nm and 50.0 ppm @ 1418.8 nm. After different combinations of differential evolution walkers, numbers of layers, thickness bounds, a couple of different optimization strategies, the optimum design has consistently converged with 19 - 26 layer pairs (total of 38 - 52 layers). The picks are based on the sensitivities, E_field at the boundary, and a qualitatively uniform stack (discarded "insane-looking" solutions). The top picks in Attachment 1 may be a good starting point for a manufacturer. In order of appearance, they are:

1. ETM_210218_1632
2. ETM_210222_1621
3. ETM_210302_1210
4. ETM_210302_1454

## ITM

For ITM, the target transmissivities are 2000 ppm @ 2128.2 nm and 50.0 ppm @ 1418.8 nm (critically coupled cavity for AUX). The lower trans for 2128.2 nm made this easier faster to converge, although the number of thin film layers was equally centered about ~ 50 layers. Haven't explored as much in the parameter space, but the top picks in Attachment 2 are decent for approaching manufacturer. In order of appearance, they are:

1. ITM_210303_1806
2. ITM_210204_1547
3. ITM_210304_1714

Attached is a cartoon partial view into the heat load experienced by the Mariner assembly.

The omnigraffle file with more explicit arrow labelling in the 'layers' tab is available here. The dashed red lines along to top represent vacuum chamber radiation incident on all sides of the OS/IS, not just from the top. Off picture to the right is the BS, left is the beam tube/ETM chamber -- hence the lower absored laser power (solid line) absorbtion (PR power + no HR coating absorption).

Parameters:

• Emissivities are listed outside the cartoon.
• Shields consist of polished aluminum outer surfaces and high emissivity inner surfaces.
• 1 W input power, 50 W power recycling, 30 kW cavity power
• All shields held at 77K
• 20 ppm/cm bulk silicon absoprtion, 5 ppm coating absorption

Assumptions

• Steady state condition, where the shields are able to be cooled/held to 77K
• Holes punched into the inner shield for stops, magnets, etc are assumed to shine RT light onto 123K TM
• This is very conservative, MOS will stablize at some temp and the OS should block ~all vacuum chamber radiation not funneled through inner shield snout

Missing or wrong

• [M] Contribution of MOS conduction and emission on the outer shield heat budget
• [M] Inner shield
• [W] OS inner surface currently modelled as one surface seeing incident RT light, need to accomodate the view factor of each of the 5 high e sides to the open maw of the OS
• [M] Conduction through shield masses, how efficient is it to link them with straps
• [M] no AR coating absorption
• [M/W] Cold finger cooling power from room temp shield to 77K cryocooler ('wrong' label because 61W is only the heat load once shields are cooled):
• Worst case to reach: 1.5m connection between tank flange and shield (from flange at bottom of the tank)
• Phosphorous deoxidized copper:  5 cm diameter
• ETP copper:  3.5 cm diameter
• Best case: 0.5m connection, from flange at level of OS
• Phos deox Cu: 3 cm diameter
• ETP Cu: 2 cm diameter
• ​​​$q_{\text{conductive}} = \frac{A}{L} \left[\int_{4\, \text{K}}^{T_2} \lambda(T) dT - \int_{4\, \text{K}}^{T_1} \lambda(T)dT \right]$
2   Thu May 21 12:10:03 2020 StephenGeneralResourcesOngoing Mariner Resources