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Message ID: 3     Entry time: Fri Jun 5 11:13:50 2020
Author: Raymond 
Type: General 
Category: Heat Load 
Subject: Steady state heat load example 

Attached is a cartoon partial view into the heat load experienced by the Mariner assembly.

The omnigraffle file with more explicit arrow labelling in the 'layers' tab is available here. The dashed red lines along to top represent vacuum chamber radiation incident on all sides of the OS/IS, not just from the top. Off picture to the right is the BS, left is the beam tube/ETM chamber -- hence the lower absored laser power (solid line) absorbtion (PR power + no HR coating absorption). 

Parameters: 

  • Emissivities are listed outside the cartoon.
  • Shields consist of polished aluminum outer surfaces and high emissivity inner surfaces. 
  • 1 W input power, 50 W power recycling, 30 kW cavity power
  • All shields held at 77K 
  • IS snout radius is equal to TM radius
  • 20 ppm/cm bulk silicon absoprtion, 5 ppm coating absorption

Assumptions

  • Steady state condition, where the shields are able to be cooled/held to 77K
  • Holes punched into the inner shield for stops, magnets, etc are assumed to shine RT light onto 123K TM
    • This is very conservative, MOS will stablize at some temp and the OS should block ~all vacuum chamber radiation not funneled through inner shield snout

Missing or wrong

  • [M] Contribution of MOS conduction and emission on the outer shield heat budget
  • [M] Inner shield 
  • [W] OS inner surface currently modelled as one surface seeing incident RT light, need to accomodate the view factor of each of the 5 high e sides to the open maw of the OS
  • [M] Conduction through shield masses, how efficient is it to link them with straps
  • [M] no AR coating absorption 
  • [M/W] Cold finger cooling power from room temp shield to 77K cryocooler ('wrong' label because 61W is only the heat load once shields are cooled):
    • Worst case to reach: 1.5m connection between tank flange and shield (from flange at bottom of the tank)
      • Phosphorous deoxidized copper:  5 cm diameter
      • ETP copper:  3.5 cm diameter
    • Best case: 0.5m connection, from flange at level of OS
      • Phos deox Cu: 3 cm diameter
      • ETP Cu: 2 cm diameter
    • ​​​q_{\text{conductive}} = \frac{A}{L} \left[\int_{4\, \text{K}}^{T_2} \lambda(T) dT - \int_{4\, \text{K}}^{T_1} \lambda(T)dT \right]
Attachment 1: Heat_Load_Sketch.pdf  23 kB  Uploaded Fri Jun 5 14:32:47 2020  | Hide | Hide all
Heat_Load_Sketch.pdf
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