Summary post pulling together numbers on heat shields. For future reference.
Drawings and Soildworks files can be found at the following links:
Purchase orders for copper parts: INSERTLINKtowiki
Goldplating specs, vendor and PO: INSERTLINKtowiki
These values were pulled from the SolidWorks files:
Cylindrical heat shield
| Property |
Value |
| Rough dimensions |
ø44.45x76.2 mm (wall thickness 1.63 mm) |
| Mass |
72.06 g |
| Heat capacity |
27.75 J/K |
| Outward facing surface area |
100.81 cm^2 |
| Total surface area |
201.95 cm^2 |
| Emissivity polished copper |
0.04-0.05 |
| Emissivity oxidized copper |
0.5-0.8 |
| Emissivity Au (gold) |
0.02-0.03 |
End caps of heat shield (per each x2)
| Property |
Value |
| Rough dimensions (outer face, see drawing for details) |
face diameter ø44.45; center hole diameter ø12.7 mm |
| Mass |
42.89 g |
| Heat capacity |
16.51 J/K |
| Outward facing surface area |
14.25 cm^2 |
| Total surface area |
52.47 cm^2 |
Material properties Cu and Au
| Emissivity polished copper |
0.04-0.05 |
| Emissivity oxidized copper |
0.5-0.8 |
| Emissivity Au (gold) |
0.02-0.03 |
| Density |
8.96 g/cm3 |
| Thermal conductivity |
401 W/(m·K) |
TOTALS: Properties of heat shield assembly
| Property |
Value |
| Rough dimensions |
ø44.45x76.2 mm (wall thickness 1.63 mm) |
| Mass |
157.83 g |
| Heat capacity |
60.76 J/K |
| Outward facing surface area |
205.75 cm^2 |
| Open hole area (end holes and other screw holes) |
2.71 cm^2 |
| Radiative cooling time constant/slew rate (for shield @ 45C in 35 C environment) |
4.7e-4 K/s |
| DC heat load kept @ 45C in 35C environment |
29 mW
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*Emissivities drawn from Rathore and Kapuno, Engineering heat transfer, Jones & Bartlett Learning, 2011
edit: Mon Oct 10 17:46:40 2016 added DC heat load and radiative cooling slew rate to TOTALS table
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