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Entry  Thu Aug 1 03:34:35 2013, Chloe, DailyProgress, ECDL, Assembling ECDL 
    Reply  Thu Aug 1 18:33:12 2013, Chloe, DailyProgress, ECDL, Assembling ECDL tempsensor.PNG
       Reply  Fri Aug 2 18:15:06 2013, Chloe, DailyProgress, ECDL, Assembling ECDL possible_tec_mount.PNG
          Reply  Mon Aug 5 18:47:04 2013, Chloe, DailyProgress, ECDL, Assembling ECDL heating.PNGcooling.PNGnoise_beginning.JPG
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                Reply  Wed Aug 7 18:13:21 2013, Chloe, DailyProgress, ECDL, Assembling ECDL 
                   Reply  Thu Aug 8 18:43:44 2013, Chloe, DailyProgress, ECDL, Assembling ECDL 100_0081.JPGcool_bridge.PNGheat_bridge.PNG
                      Reply  Fri Aug 9 18:01:47 2013, Chloe, DailyProgress, ECDL, Assembling ECDL cool_bridge2.PNGheat_bridge2.PNG
                         Reply  Tue Aug 13 18:13:35 2013, Chloe, DailyProgress, ECDL, Assembling ECDL 
                            Reply  Thu Aug 15 18:53:45 2013, Chloe, DailyProgress, ECDL, Assembling ECDL 100_0104.JPG
Message ID: 1277     Entry time: Fri Aug 2 18:15:06 2013     In reply to: 1273     Reply to this: 1281
Author: Chloe 
Type: DailyProgress 
Category: ECDL 
Subject: Assembling ECDL 

Today I calibrated the PID gain on the TEC. In order to do this, I used a silicone heat sink compound to help the thermal conductivity between the Peltier element/thermistors and the TEC. Then, I held things together using aluminum tape.

I calibrated the TEC so it reaches the correct resistance after only overshooting the value once. It is usually able to reach the correct temperature within about 30 seconds. I had the temperature sensor I built yesterday hooked up to an oscilloscope so that I can monitor the fluctuations in voltage across the thermistor (directly related to resistance). However, my flash drive doesn't work and I didn't have a spare on me today so I will try and record the oscilloscope output either this weekend or on Monday morning. This will be used to estimate the transfer function of the TEC controller. 

Important: there is a directionality to the TEC element. There is a hot side and a cold side. The cold side is attached to the laser diode mount, and the hot side is attached to a piece of aluminum we found around the lab to act as a temporary heat sink. Because of this we need to rework some of the design to thermally isolate the diode mount from the box, and let the box act as a heat sink. My proposed design is attached (I made a quick sketch of it in Solidworks). I'm still thinking about the best way to incorporate the Peltier element. 

Tara will order the collimator lens, window, and PZT this weekend. Still trying to figure out if it's possible to build a collimator mount that will be sufficient to serve our purposes. 

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