For the final packaging/mounting of the sensor to the seismometer, I have thought of two options.
1. Attach circuit to a PCB board and place it inside the can, while leaving the AD590 open to the air inside the can.
2. Attach the AD590 to a copper plate with thermal paste and put it into a pomona box.
If anyone has input on which method is preferred or any additional options that we may have, I would appreciate it.
q = k A dT / s
For copper, k = 401 W/mK, x = 1.27 mm, A = 2.66x10^-3 m^2 (for the particular copper plate I measured), dT = 1K (assume). Thus the heat transfer will be 839 J/s.
I'm not completely sure what to do with this yet, but it could help us decide whether the copper plate option will be useful for us.