For the final packaging/mounting of the sensor to the seismometer, I have thought of two options.
1. Attach circuit to a PCB board and place it inside the can, while leaving the AD590 open to the air inside the can.
 This makes sure that the sensor gets a direct measurement of the temperature of the air in the can, as it is exposed to the air.
 But, it takes a limited area of measurement, so it could be the case that the area we place it in happens to be a hot or cold pocket, and the measurement would be inaccurate.
 This can be solved by placing multiple copies of the circuit in various places of the can and averaging the values.
2. Attach the AD590 to a copper plate with thermal paste and put it into a pomona box.
 This solves the problem of having a limited sample area the first option had, as the copper plate should have a uniform temp distribution, thus we are sampling the temp of that whole area.
 Need to make sure that the response time to the temperature variations of copper is less than the frequency that we are measuring.
 This can be calculated using equations for heat transfer (listed below).
If anyone has input on which method is preferred or any additional options that we may have, I would appreciate it.
Heat transfer:
q = k A dT / s
 k = thermal conductivity
 A = area
 dT = temperature gradient
 s = thickness
For copper, k = 401 W/mK, x = 1.27 mm, A = 2.66x10^3 m^2 (for the particular copper plate I measured), dT = 1K (assume). Thus the heat transfer will be 839 J/s.
I'm not completely sure what to do with this yet, but it could help us decide whether the copper plate option will be useful for us.
