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Message ID: 11530     Entry time: Tue Aug 25 16:33:31 2015
Author: Ignacio, Steve 
Type: Configuration 
Category: PEM 
Subject: Seismometer enclosure copper foil progress 

Steve ordered about two weeks ago a roll of 0.5 mm thick copper foil to be used for the inside of the seismometer cans. The foil was then waterjet cut by someone in Burbank to the right dimensions (in two pieces, a side and a bottom for each of the three cans).

Today, we glued the copper foil (sides only) inside the three seismometer cans. We used HYSOL EE4215/HD3561(Data Sheet) as our glue. It is a "high impact, low viscocity, room temperature cure casting" that offers "improved thermal conductivity and increased resistance to heat and thermal shock." According to Steve, this is used in electronic boards to glue components when you want it to be thermal conductive.

We are going to finish this off tomorrow by gluing the bottom foil to the cans. The step after this involves soldering the side to the bottow and where the side connects. We have realized that the thermal conductivity of the solder that we are using is only ~50. This is 8 times smaller than that of copper and wil probably limit how good a temperature gradient we will have.

Some action shots,

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