0. If you have an RF signal whose waveform is , the amplitude is constant and 1.
1. If the waveform , the amplitude has the DC value of 1 and AM with the amplitude of 0.1 (i.e. swing is from 0.9 to 1.1). Therefore the RMS RIN of this signal is 0.1/1/Sqrt(2).
2. The above waveform can be expanded by the exponentials.
Therefore the sideband carrier ratio R is 0.025/0.5 = 0.05. This corresponds to 20 log10(0.05) = -26dBc
In total, we get the relationship of dBc and RIN as , or R = RIN/sqrt(2)
With Gautam's help, I ran a coating design code for an HR mirror with the standard quarter-wave design. The design used here has 17 pairs of lambda/4 layers of SiO2 and Ta2O5 (=34 layers) with the fused silica as the substrate to realize the transmission of tens of ppm. At the AOI (angle of incidence) of 4 deg (=nominal angle for the aLIGO OMC), there is no significant change in the reflectivity (transmissivity). With 95% of the case, the phase difference at the AOI of 4 deg is smaller than 0.02 deg for given 1% fluctuation (normal distribution) of the layer design and the refractive indeces of the materials. Considering the number of the OMC mirrors (i.e. 4), the total phase shift between P and S pols is less than 0.08 deg. This makes P and S resonances matched well within 1/10 of the cavity resonant width (360/F=0.9deg, F: Finesse=400).
Of course, we don't know how much layer-thickness fluctuation we actually have. Therefore, we should check the actual cavity resonance center of the OMC cavity for the polarizations.
Attachment 1 shows the complex reflectivity of the mirror for P and S pols between AOIs of 0 deg and 45 deg. Below 30 deg there is no significant difference. (We need to look at the transmission and the phase difference)
Attachment 2 shows the power transmissivity of the mirror for P and S pols between AOIs of 0 deg and 45 deg. For the purpose to check the robustness of the reflectivity, random fluctuations (normal distribution, sigma = 1%) were applied to the thicknesses of each layer, and the refractive indices of Silica and Tantala. The blue and red bands show the regions that the 90% of the samples fell in for P and S pols, respectively. There are median curves on the plot, but they are not well visible as they match with the ideal case. This figure indicates that the model coating well represents the mirror with the transmissivity better than 70ppm.
Attachment 3 shows the phase difference of the mirror complex reflectivity for P and S pols between AOIs of 0deg and 45deg. In the ideal case, the phase difference at the AOI of 4deg is 1x10-5 deg. The Monte-Carlo test shows that the range of the phase for 90% of the case fell into the range between 5x10-4 deg and 0.02 deg. The median was turned to be 5x10-3 deg.
Attachment 4 shows the histogram of the phase difference at the AOI of 4deg. The phase difference tends to concentrate at the side of the smaller angle.
I started some analytic calculations of how OMC mirror motion would add to the noise in the BHD. I want to make some prettier plots, and am adding the interferometer so I can also compute the noise due to backscatter into the IFO. However, since I've pushed the notebook I wanted to post an update. Here's the location in the repo.
I used Koji's soft limit of 0.02 degrees additional phase accumulation per reflection for p polarization.
I'm still not satisfied/done with the solution to this, but this has gone too long without an update and anyway probably someone else will have a direction to take it that prevents me spinning my wheels on solved or basic questions.
The story will have to wait to be on the elog, but I've put it in the jupyter notebook. Basically:
It's clear to me that there is a way to optimize the OMC, but the normalization of my DARM referred noise is clearly wrong, because I'm finding that the input-referred noise is at least 4e-11 m/rt(Hz). This seems too large to believe.
Indeed, I was finding the noise in the wrong way, in a pretty basic mistake. I’m glad I found it I guess. I’ll post some plots and update the git tomorrow.
A simple COMSOL simulation was run to see how the PZT deforms as the voltage applied.
Use the geometry of the ring PZT which is used in the OMCs - NAC2124 (OD 15mm, ID 9mm, H 2mm)
The material is PZT-5H (https://bostonpiezooptics.com/ceramic-materials-pzt) which is predefined in COMSOL and somewhat similar to the one used in NAC2124 (NCE51F - http://www.noliac.com/products/materials/nce51f/)
The bottom surface of the ring was electrically grounded (0V), and mechanically fixed.
Applied 100V between the top and bottom.
== Office Depot ==
Really Useful Box 9L x 6 (delivered)
Really Useful Box 17L x 5 (ordered 4/4)
P-TOUCH tape (6mm, 9mm, 12mmx2, 18mm) (ordered 4/4)
== Digikey ==
9V AC Adapter (- inside, 1.3A) for P-TOUCH (ordered 4/4)
12V AC Adapter (+ inside, 1A) for Cameras (ordered 4/4)
== VWR ==
Mask KIMBERLY CLARK "KIMTECH Pure M3" ISO CLASS 3 (ordered 4/4)
OMC(002) repair completed
When the cable harness of OMC(004) is going to be assembled, the cable harness of OMC(002) will be replaced with the PEEK one. Otherwise, the work has been done.
Note that there are no DCPDs installed to the unit. (Each site has two in the OMC and two more as the spares)
More photos: https://photos.app.goo.gl/XdU1NPcmaXhATMXw6
Preparation for the PZT subassembly bonding (Section 6.2 and 7.3 of T1500060 (aLIGO OMC optical testing procedure)
- Gluing fixture (Qty 4)
- Silica sphere powder
- Electric scale
- Toaster oven for epoxy mixture qualification
- M prisms
- C prisms
- Noliac PZTs
- Cleaning tools (forceps, tweezers)
- Bonding kits (copper wires, steering sticks)
- Thorlabs BA-2 bases Qty2
- Razor blades
Preparation for the PZT subassembly bonding (Section 6.2 and 7.3 of T1500060 (aLIGO OMC optical testing procedure)
- Gluing FIxture (Qty4)
- Silica Sphere Powder
- Electric scale
- Toaster Oven for epoxy mixture qualification
- M prisms
- C prisms
- Noliac PZTs
- Cleaning tools (forceps, tweezers)
- Bonding kits (copper wires, steering sticks)
- Thorlabs BA-2 bases Qty2
- Razor Blades
Also brought to the 40m on 10 April, in preparation for PZT subassembly bonding:
- new EP30-2 epoxy (purchased Jan 2019, expiring Jul 2019 - as documented on documents attached to glue, also documented at C1900052.
- EP30-2 tool kit (maintained by Calum, consisting of mixing nozzles, various spatulas, etc)
Already at the 40m for use within PZT subassembly bonding:
- "dirty" ABO A with temperature controller (for controlled ramping of curing bake)
- clean work areas on laminar flow benches
- Class B tools, packaging supplies, IPA "red wipes", etc.
Upon reviewing EP30-2 procedure T1300322 (current revision v6) and OMC assembly procedure E1300201 (current revision v1) it appears that we have gathered everything required.
The four PZT sub-assemblies were glued in the gluing fixtures. There were two original gluing fixtures and two additional modified fixtures for the in-situ bonding at the repair of OMC(002).
- Firstly, we checked the fitting and arrangements of the components without glue. The component combinations are described in ELOG 329.
- Turned on the oven toaster for the cure test (200F).
- Then prepared EP30-2 mixture (7g EP30-2 + 0.35g glass sphere).
- The test specimen of EP30-2 was baked in the toaster oven. (The result shows perfect curing (no stickyness, no finger print, crisp fracture when bent)
- Applied the bond to the subassemblies.
- FInally the fixtures were put in airbake Oven A. We needed to raise one of the tray with four HSTS balance weights (Attachment 2).
The baking of the PZT subassemblies was more complicated than we initially thought.
The four PZT subassemblies were placed in the air bake oven A. We meant to bake the assemblies with the ramp time of 2.5h, a plateau of 2h at 94degC, and slow ramp down.
The oven controller was started and the temperature has been monitored. The ramping up was ~20% faster than expected (0.57degC/min instead of 0.47degC/min), but at least it was linear and steady.
Once the temperature reached the set temperature (around t=120min), the temperature started oscillating between 74 and 94degC. Stephen's interpretation was that the PID loop of the controller was not on and the controller falled into the dead-bang mode (=sort of bang-bang control).
As the assembly was already exposed to T>70F for more than 2.5hours, it was expected the epoxy cure was done. Our concern was mainly the fast temperature change and associated stress due to thermal expansion, which may cause delamination of the joint. To increase the heat capacity of the load, we decided to introduce more components (suspension balance weights). We also decided to cover the oven with an insulator so that the conductive heat loss was reduced.
However, the controller thought it was already the end of the baking process and turned to stand-by mode (i.e. turned off everything). This started to cause rapid temp drop. So I (Koji) decided to give a manual heat control for mind cooling. When the controller is turned off and on, it gives some heat for ramping up. So the number of heat pulses and the intervals were manually controlled to give the temp drop of ~0.5degC/min. Around t=325, the temperature decay was already slower than 0.5degC/min without heat pulse, so I decided to leave the lab.
We will check the condition of the sub-assemblies tomorrow (Fri) afternoon.
(Friday afternoon) We retrieved the PZT sub-assemblies to the clean room.
We started removing the ASSYs from the fixtures. We noticed that some part of the glass and PZT are ripped off from the ASSY and stuck with the fixture. For three ASSYs (except for #9), the effect is minimal. However, ASSY #9 has two large removals on the front surface, and one of the bottom corners got chipped. This #9 is still usable, I believe, but let's avoid to use this unit for the OMC. Individual inspection of the ASSYs is posted in the following entries.
This kind of fracture events was not visible for the past 6 PZT sub-ASSYs. This may indicate a few possibilities:
- More rigorous quality control of EP30-2 was carried out for the PZT ASSY bonding. (The procedure was defined after the past OMC production.) The procedure leads to the strength of the epoxy enhanced.
- During the strong and fast thermal cycling, the glass was exposed to stress, and this might make the glass more prone to fracture.
For the production of the A+ units, we think we can avoid the issues by modifying the fixtures. Also, reliable temperature control/monitor technology should be employed. These improvements should be confirmed with the bonding of spare PZTs and blank 1/2" mirrors before gluing any precious components.
Probably the best glued unit among the four.
Attachment #1: Mounting Block SN001
Attachment #2: PZT-Mounting Block bonding looks completely wet. Excellent.
Attachment #3: The other side of the PZT-Mounting Block bonding. Also looks excellent.
Attachment #4: Overall look.
Attachment #5: The mirror-PZT bonding also look excellent. The mounting block surface has many EP30-2 residue. But they were shaved off later. The center area of the aperture is clear.
Attachment #6: A small fracture of the mirror barrel is visible (at 7 o'clock).
Attachment #1: Mounting Block SN007
Attachment #2: Overall look.
Attachment #3: Some fracture on the barrel visible.
Attachment #4: It is visible that a part of the PZT removed. Otherwise, PZT-Mounting Block bonding looks pretty good.
Attachment #5: The other side of the PZT bonding. Looks fine.
Attachment #6: Fractured PZT visible on the fixture parts.
Attachment #7: Fractured glass parts also visible on the fixture parts.
Attachment #8: MIrror bonding looks fine except for the glass chip.
The most fractured unit among four.
Attachment #1: Mounting Block SN017
Attachment #2: Two large removals well visbile. The bottom right corener was chipped.
Attachment #3: Another view of the chipping.
Attachment #4: PZT-mounting block bonding look very good.
Attachment #5: Another view of the PZT-mounting block bonding. Looks very good too.
Attachment #6: Fractures bonded on the fixture.
Attachment #7: Front view. The mirror-PZT bonding look just fine.
Attachment #1: Mounting Block SN021
Attachment #2: PZT-Mounting Block bonding looks just excellent.
Attachment #3: The other side of the PZT-Mounting Block bonding is also excellent.
Attachment #4: The mirror-PZT bonding also look excellent. Some barrel fracture is visible at the lower left of the mirror.
Apr 16, 2019
Borrowed two laser goggles from the 40m. (Returned Apr 29, 2019)
Borrowed small isopropanol glass bottole from CTN.
Apr 19, 2019
Borrowed from the 40m:
- Universal camera mount
- 50mm CCD lens
- zoom CCD lens (Returned Apr 29, 2019)
- Olympus SP-570UZ (Returned Apr 29, 2019)
- Special Olympus USB Cable (Returned Apr 29, 2019)
[Stephen, Philip, Koji, Joe]
Breadboard D1200105 SN06 was selected as described in eLOG 338. This log describes unwrapping and preparation of the breadboard.
Relevant procedure section: E1300201 section 6.1.5
Breadboard was unwrapped. No issues observed during unwrapping.
Visual inspection showed no issues observed in breadboard - no large scratches, no cracks, no chipping, polished area (1 cm margin) looks good.
Initially the breadboard has a large amount of dust and fiber from the paper wrapping. Images were gathered using a green flashlight at grazing incidence (technique typical of optic inspection).
PROCEDURE IMPROVEMENT: Flashlight inspection and Top Gun use should be described (materials, steps) in E1300201.
Top gun was used (with medium flow rate) to remove large particulate. Breadboard was placed on Ameristat sheet during this operation.
Next, a clean surface within the cleanroom was protected with Vectra Alpha 10 wipes. The breadboard, with reduced particulate after Top Gun, was then placed inside the cleanroom on top of these wipes. Wiping with IPA Pre-wetted Vectra Alpha 10 wipes proceeded until the particulate levels were acceptable.
Joe and Koji then proceeded with placing the breadboard into the transport fixture.
[Joe, Koji, Liyuan, Philip, Stephen]
Work done on 16.04.2019
Finishing assembly of transport box
Assembly worked fine except for the clamping structure to clamp the lid of the transport box to the bottom part.
It seemed that some of the plastic of these clamps became brittle during the baking. The plastic was removed and the
clamps where wiped clean. It appears that the clamps can't be locked as they should. Still the transport box should be fine
as the long screws will mainly clamp the two parts together.
Preparing the transport box to mount the breadboard
The lid of the the transport box was placed upside down and clamped to the table. All peak clamping structures where pulled back as far as possible.
Preparation and cleaning of the breadboard
We unpacked the breadboard and found lots of dust particles on it (most likely from the soft paper cover which was used). We used the ionized nitrogen gun
at 25 psi to get rid of the majority of particles and cross-checked with a bright green flash light before and after blowing. The second stage of cleaning was done
below the clean room tent and included the wiping of all surfaces. The breadboard was then placed into the prepared lid of the transport box and clamped with peak
Unpacking of the template
The previously cleaned template was unpacked while the last layer of coverage was removed below the cleanroom tent.
Template adjustment on the breadboard
All peak screws of the clamping structure of the template where removed. The template was placed onto the breadboard only seperated by peak spacers.
All peak screws have been inserted for horizontal clapming. A calipper was used to measure the distance of each edge of the template to the edge of the
breadboard. For documentation the labeled side of the bradboard (facing away from the persons on the pictures) of the upside down breadboard is defined to
be the south side, continuing clockwise with west, north and east. First rough alignment was done by shifting the template on the breadboard and then the
peak screws where used for fine tuning. The caliper values measured where:
North C 8.32mm E 8.52 mm W 8.41 mm
East C 8.08 mm
South C 8.32 mm
West C 8.02 mm
(E indicating east side position, W indicating west side position and C indicating center position)
As mentioned in eLOG 331, either increased thermal cycling or apparent improvements in cured EP30-2 strength led to fracture of curved mirrors at unintended locations of bonding to the PEEK fixture parts.
The issue and intended resolution is summarized in the attached images (2 different visualizations of the same item).
Redline has been posted to D1600336-v3.
Drawing update will be processed shortly, and parts will be modified to D1600336-v4.
Notes on the OMC cavity alignment strategy
- x3=1.17 γ + 1.40 δ, x4=1.40 γ + 1.17 δ
- This means that the effect of the two curved mirrors (i.e. gouy phases) are very similar. To move x3 and x4 in common is easy, but to do differentially is not simple.
- 1div of a micrometer is 10um. This corresponds to the angular motion of 0.5mrad (10e-6/20e-3 = 5e-4). ~0.5mm spot motion.
- ~10um displacement of the mirror longitudinal position has infinitesimal effect on the FSR. Just use either micrometer (-x side).
- 1div of micrometer motion is just barely small enough to keep the cavity flashing. => Easier alignment recovery. Larger step causes longer time for the alignment recovery due to the loss of the flashes.
- After micrometer action, the first move should be done by the bottom mirror of the periscope. And this is the correct direction for beam walking.
- If x3 should be moved more than x4, use CM2, and vise versa.
- If you want to move x3 to +x and keep x4 at a certain place, 1) Move CM2 in (+). This moves x3 and x4 but x3>x4. 2) Compensate x4 by turning CM1 in (-). This returnes x4 to the original position (approximately), but leave x3 still moved. Remember the increment is <1div of a micrometer and everytime the cavity alignment is lost, recover it before loosing the flashes.
Suddenly something dirty emerged in the lab. What is this? It looks like an insulation foam or similar, but is quite degraded and emits a lot of particulates.
This does not belong to the lab. I don't see piping above this area which shows broken insulation or anything. All the pipes in the room are painted white.
The only possibility is that it comes from the hole between the next lab (CRIME Lab). I found that the A.C. today is much stronger and colder than last week. And there is a positive pressure from CRIME Lab. Maybe the foam was pushed out from the hole due to the differential pressure (or any RF cable action).
That is an expanding fire pillow, also known as firebrick. It is used to create a fire block where holes in fire-rated walls are made and prevents lab fires from spreading rapidly to adjacent labs. I had to pull cable from B254 to our labs on either side during a rather narrow window of time. Some of the cable holes are partially blocked, making it difficult to reach the cable to them. The cable is then just guided to the hole from a distance. With no help, it's not possible to see this material getting shoved out of the hole. I can assure you that I took great pains not to allow the CYMAC coax to fall into any equipment, or drag against any other cables.
Summary: Beginning on 20 May 2019, two CM PZT assemblies were soaked in Acetone in an effort to debond the EP30-2 bonds between tombstone-PZT and between PZT-optic. Debonding was straightforward after 8 days of soaking. 24 hours of additional acetone soaking will now be conducted in an attempt to remove remnant EP30-2 from bonding surfaces.
Procedure: The assemblies were allowed to soak in acetone for 8 days, with acetone level below the HR surface of the optic. No agitation of the solution, mechanical abrasion of the bond, or other disturbance was needed for the bond to soften.
GariLynn contributed the glassware and fume hood, and advised on the process (similar to debonding of CM and PZT from OMC SN002 after damaging event). The equipment list was (WIP, more detail / part numbers will be gathered today and tomorrow):
Results: Today, 28 May 2019, I went to the lab to check on the optics after 8 days of soaking. Liyuan had monitored the acetone level during the first 4 days, topping up once on 24 May. All bonds were fully submerged for 8 days.
There were 2 assemblies soaked in one crystallizing dish. Debonded assemblies - ref OMC eLOG 328 for specified orientations and components:
PZT Assy #9 - ref. OMC eLOG 334 - M17+PZT#12+C10
PZT Assy #7 - ref. OMC eLOG 332 - M1+PZT#13+C13
PZT Assy #7 was investigated first.
A video of removal of C10 and PZT#12 from PZT Assy #9 was collected (See Attachment 8), showing the ease with which the debonded components could be separated.
Photos and video have been be added to supplement this report (edit 2019/07/08).
Here is a summary of the events of the last week, as they relate to EP30-2.
1) I lost the EP30-2 syringes that had been ordered for the OMC, along with the rest of the kit.
2) The EP30-2 syringes ordered for the OMC Unit 4 build from January had already expired, without me noticing.
3) LHO shipped expired epoxy on Thursday. Package not opened until Monday.
4) Current, unopened syringe of EP30-2 has been received from LHO. Expiration date is 22 Jan 2020. Syringe storage has been improved. Kit has been docked at its home in Downs 303 (Modal Lab) (see attached photo, taken before receipt of new epoxy).
Current Status: Epoxy is ready for PZT + CM subassembly bonding on Monday afternoon 23 September.
The following items are presently staged at the 40m Bake Lab (see photo indicating current location) (noting items broght by Koji as well):
The following item is in its home in Downs 303 (Modal Lab)
The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab, so I have had to play with the tuning and parameters to recover a suitable bake profile. This bake is pictured below (please excuse the default excel formatting).
I have increased the ramp time, temperature offset, and thermal mass within the oven; after retuning and applying the parameters indicated, the rate of heating/cooling never exceeds .5°C/min.
The ABO is controlled by a different temperature readout from the data logger used to collect data; the ABO readout is a small bead in contact with the shelf, while the data logger is a lug sandwiched between two stainless steel masses upon the shelf. I take the data logger profile to be more physically similar to the heating experienced by an optic in a gluing fixture, so I feel happy about the results of the above bake.
I plan to add the data source file to this post at my earliest convenience.
[Stephen, Shruti, Koji]
We worked on the gluing of the PZT sub-assy (#9 and #10) along with the designed arrangement by Shruti (OMC ELOG 374).
The detailed procedures are described in E1300201 Section 6.2 PZT subassembly and Section 7.3 EP30-2 gluing.
We found that the PZTs, which were debonded from the previous PZT sub assy with acetone, has some copper wires oxidized. However, we confirmed that this does not affect the conductivity of the wires, as expected.
The glue test piece cooked in the toaster oven showed excellent curing. GO SIGNAL
Stephen painted the PZT as shown in Attachment 1.
The fixtures were closed with the retaining plate and confirmed that the optics are not moving in the fixtures.
At this point, we checked the situation of the air-bake oven. And we realized that the oven controller was moved to another vacuum oven and in use with a different setting.
Stephen is going to retrieve the controller to the air bake oven and test the temp profile overnight. Once we confirm the setting is correct, the PZT sub assys will be heat cured in the oven. Hopefully, this will happen tomorrow. Until then, the sub-assys are resting on the south flow bench in the cleanroom.
The 40m Bake Lab's Dirty ABO's OMEGA PID controller was borrowed for another oven in the Bake Lab (sound familiar? OMC elog 377), so I have had to play with the tuning and parameters to recover. This bake seemed to inadequately match the intended temperature profile for some reason (intended profile is shown by plotting prior qualifying bake for comparison).
The parameters utilized here are exactly matching the prior qualifying bake, except that the autotuning may have settled on different parameters.
Options to proceed, as I see them, are as follows:
Follow up on OMC elog 379
I was able to obtain the following (dark blue) bake profile, which I believe is adequate for our needs.
The primary change was a remounting of the thermocouple to sandwich it between two stainless steel masses. The thermocouple bead previously was 1) in air and 2) close to the oven skin.
Friday: [Stephen, Koji]
As the oven setting has qualified, we brought the PZT assys in the air bake oven.
Monday: [Stephen, Shruti, Koji]
We brought the PZT assys to the clean room. There was not bonding between the flexture and the PZT subassy (Good!). Also the bonding o at each side looks completely wetted and looks good. The package was brought to the OMC lab to be tested in the optical setup.
OMC PZT Assy Production Cure Bake (ref. OMC elog 381) for PZT Assy #9 and #10 started 27 September 2019 and completed 28 September 2019. Captured in the below figure (purple trace). Raw data has been posted as an attachment as well.
We have monitored the temperature in two ways:
1) Datalogger thermocouple data (purple trace).
2) Checking in on temperature of datalogger thermocouple (lavender circles) and drive thermocouple (lavender diamonds), only during initial ramp up.
Comments on bake:
This post captures the curing timeline followed by OMC PZT Assys #9 and #10.
Source file posted in case any updates or edits need to be made.
The following is the current status of the epoxies used in assembly of the OMC (excerpt from C1900052)
Re-purchasing efforts are underway and/or complete
20 glass beamdumps were bonded at the 40m cleanroom.
Attachment 1: We had 20 fused silica disks with a V-groove and 40 black glass pieces
Attachment 2: The black glass pieces had (usual) foggy features. It is well known to be very stubborn. We had to use IPA/acetone and wiping with pressure. Most of the feature was removed, but we could still see some. We decided to use the better side for the inner V surfaces.
Attachment 3: EP30-2 expiration date was 1/22/2020 👍. 7.66g of EP30-2 was poured and 0.38g of glass sphere was added. Total glue weight was 8.04g
Attachment 4: Glue test piece was baked at 200F in a toaster oven for ~12min. It had no stickiness. It was totally crisp. 👍👍👍
Attachment 5: Painted glue on the V-groove and put the glass pieces in. Then gave a dub of blue at the top and bottom of the V from the outside. In the end, we mostly had the glue went through the V part due to capillary action.
Attachment 6: The 20 BDs were stored in stainless vats. We looked at them for a while to confirm there is no drift and opening of the V part. Because the air bake oven was not available at the time, we decided to leave the assys there for the room temp curing, and then later bake them for the completion of the curing.
[Koji, Jordan, Stephen]
The beam dumps, bonded on Fri 06 Dec 2019, were placed in the newly tuned and configured small dirty ABO at the Bake Lab on Fri 13 Dec 2019.
Images are shared and references are linked below
Bonding log entry - https://nodus.ligo.caltech.edu:8081/OMC_Lab/386
Bake ticket - https://services.ligo-wa.caltech.edu/clean_and_bake/request/992/
OMC Beam Dump - https://dcc.ligo.org/LIGO-D1201285
The beamdumps were taken out from the oven and packed in bags.
The bottom of the V are completely "wet" for 17 BDs among 20 (Attachment 1/2).
3 BDs showed insufficient glue or delamination although there is no sign of lack of rigidity. They were separated from the others in the pack.
Item lending as per Ian's request: Particle Counter from OMC Lab to QIL
The particle counter came back to the OMC lab on Aug 10, 2020
Check-in to the OMC lab to see the status. Nothing seemed changed. No bug. The HEPA is running normal. The particle level was 0.
Went into the HEPA enclosure and put a cover on the OMC. Because of the gluing template, the lid could not be close completely (that's expected and fine).
The IPA vector cloth bag was not dry yet but seemed expired (some smell). There is no stock left -> 5 bags to be ordered.
are there any measurements of the BRDF of these things? I'm curious how much light is backscattered into the incoming beam and how much goes out into the world.
Maybe we can take some camera images of the cleaned ones or send 1-2 samples to Josh. No urgency, just curiosity.
I saw that ANU and also some labs in India use this kind of blue/green glass for beam dumps. I don't know much about it, but I am curious about its micro-roughness and how it compares to our usual black glass. For the BRDF, I think the roughnesss matters more for the blackness than the absorption.
According to the past backscatter test of the OMC (and the black glass beamdump: not V type but triangular type on a hexagonal-mount), the upper limit of the back reflection was 0.13ppm. https://nodus.ligo.caltech.edu:8081/OMC_Lab/209
I don't have a BRDF measurement. We can send a few black glass pieces to Josh.
To spare some room on the optical table, I wanted to mount the two TFT monitor units on the HEPA enclosure frame.
I found some Bosch Rexroth parts (# 3842539840) in the lab, so the bracket was taken for the mount. This swivel head works very well. It's rigid and still the angle is adjustable.
BTW, this TFT display (Triplett HDCM2) is also very nice. It has HDMI/VGA/Video/BNC inputs (wow perfect) and the LCD is Full-HD LED TFT.
The only issue is that one unit (I have two) shows the image horizontally flipped. I believe that I used the unit with out this problem before, I'm asking the company how to fix this.
The image flipping of the display unit was fixed. The vendor told me how to fix it.
- Open the chassis by the four screws at the side.
- Look at the pass-through PCB board between the mother and display boards.
- Disconnect the flat flex cables from the pass-through PCB (both sides) and reconnect them (i.e. reseat the cables)
That's it and it actually fixed the image flipping issue.
See this entry: https://nodus.ligo.caltech.edu:8081/40m/15642
Thorlabs' powermeter controler + S401C head was lent from OMC Lab.
I helped to complete the 5th OMC Transport Fixture. It was built at the 40m clean room and brought to the OMC lab. The fixture hardware (~screws) were also brought there.
FEMTO DLPCA200 low noise preamp (brand new)
Keithley Source Meter 2450 (brand new) => Returned 11/23/2020
were brought to the OMC lab for temporary use.
OMC Unit 4 Build Machined Parts are currently located in Stephen's office. See image of large blue box from office, below.
Loaned item D1100855-V1-00-OMC08Q004 to Don Griffith for work in semi-clean HDS assy.
This includes mass mounting brackets, cable brackets, balance masses, etc. For full inventory, refer to ICS load Bake-9527 (mixed polymers) and Bake-9495 (mixed metals).
Inventory includes all items except cables. Plasma sprayed components with slight chipping were deemed acceptable for Unit 4 use. Cable components (including flex circuit) are ready to advance to fabrication, with a bit more planning and ID of appropriate wiring.