[Stephen, Philip, Koji, Joe]
Breadboard D1200105 SN06 was selected as described in eLOG 338. This log describes unwrapping and preparation of the breadboard.
Relevant procedure section: E1300201 section 6.1.5
Breadboard was unwrapped. No issues observed during unwrapping.
Visual inspection showed no issues observed in breadboard - no large scratches, no cracks, no chipping, polished area (1 cm margin) looks good.
Initially the breadboard has a large amount of dust and fiber from the paper wrapping. Images were gathered using a green flashlight at grazing incidence (technique typical of optic inspection).
PROCEDURE IMPROVEMENT: Flashlight inspection and Top Gun use should be described (materials, steps) in E1300201.
Top gun was used (with medium flow rate) to remove large particulate. Breadboard was placed on Ameristat sheet during this operation.
Next, a clean surface within the cleanroom was protected with Vectra Alpha 10 wipes. The breadboard, with reduced particulate after Top Gun, was then placed inside the cleanroom on top of these wipes. Wiping with IPA Pre-wetted Vectra Alpha 10 wipes proceeded until the particulate levels were acceptable.
Joe and Koji then proceeded with placing the breadboard into the transport fixture.