40m QIL Cryo_Lab CTN SUS_Lab TCS_Lab OMC_Lab CRIME_Lab FEA ENG_Labs OptContFac Mariner WBEEShop
  OMC elog  Not logged in ELOG logo
Message ID: 329     Entry time: Thu Apr 11 21:22:26 2019
Author: Koji 
Type: Mechanics 
Category: General 
Subject: OMC(004): PZT sub-assembly gluing 

[Koji Stephen]

The four PZT sub-assemblies were glued in the gluing fixtures. There were two original gluing fixtures and two additional modified fixtures for the in-situ bonding at the repair of OMC(002).

- Firstly, we checked the fitting and arrangements of the components without glue. The component combinations are described in ELOG 329.
- Turned on the oven toaster for the cure test (200F).
- Then prepared EP30-2 mixture (7g EP30-2 + 0.35g glass sphere).
- The test specimen of EP30-2 was baked in the toaster oven. (The result shows perfect curing (no stickyness, no finger print, crisp fracture when bent)
- Applied the bond to the subassemblies.
- FInally the fixtures were put in airbake Oven A. We needed to raise one of the tray with four HSTS balance weights (Attachment 2).

Attachment 1: IMG_7561.jpg  1.669 MB  Uploaded Sun Apr 14 23:39:46 2019  | Show | Hide all | Show all
Attachment 2: IMG_7567.jpg  2.263 MB  Uploaded Sun Apr 14 23:40:00 2019  | Hide | Hide all | Show all
ELOG V3.1.3-