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Entry  Wed Apr 10 19:22:24 2019, Koji, General, General, OMC(004): preparation for the PZT subassembly bonding  
    Reply  Thu Apr 11 10:54:38 2019, Stephen, General, General, OMC(004): preparation for the PZT subassembly bonding  
Message ID: 327     Entry time: Thu Apr 11 10:54:38 2019     In reply to: 326
Author: Stephen 
Type: General 
Category: General 
Subject: OMC(004): preparation for the PZT subassembly bonding  
Quote:

Preparation for the PZT subassembly bonding (Section 6.2 and 7.3 of T1500060 (aLIGO OMC optical testing procedure)
- Gluing FIxture (Qty4)
- Silica Sphere Powder
- Electric scale
- Toaster Oven for epoxy mixture qualification

- M prisms
- C prisms
- Noliac PZTs

- Cleaning tools (forceps, tweezers)
- Bonding kits (copper wires, steering sticks)
- Thorlabs BA-2 bases Qty2
- Razor Blades

 

Also brought to the 40m on 10 April, in preparation for PZT subassembly bonding:

- new EP30-2 epoxy (purchased Jan 2019, expiring Jul 2019 - as documented on documents attached to glue, also documented at C1900052.

- EP30-2 tool kit (maintained by Calum, consisting of mixing nozzles, various spatulas, etc)

 

Already at the 40m for use within PZT subassembly bonding:

- "dirty" ABO A with temperature controller (for controlled ramping of curing bake)

- clean work areas on laminar flow benches

- Class B tools, packaging supplies, IPA "red wipes", etc.

 

Upon reviewing EP30-2 procedure T1300322 (current revision v6) and OMC assembly procedure E1300201 (current revision v1) it appears that we have gathered everything required.

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